| Allicdata Part #: | ATS18532-ND |
| Manufacturer Part#: |
ATS-11A-138-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-138-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has become one of the most critical components in today\'s electronics industry. The need for efficient, cost-effective, and reliable cooling solutions is becoming increasingly important in order to maintain superior system performance. The ATS-11A-138-C2-R0 is a thermal heat sink that is designed to provide highly efficient thermal management solutions for a wide variety of applications. This article will provide an overview of the ATS-11A-138-C2-R0’s application field and working principle.
The ATS-11A-138-C2-R0 is a cost-effective, reliable aluminum heat sink that provides superior cooling for a range of applications. Its thin-film thermal transfer technology ensures that heat is distributed evenly and efficiently. The C2-R0 heat sink also features a die-cast aluminum construction for improved structural integrity. This heat sink can be installed directly onto the electronic component it is cooling and can handle temperatures up to 50°C.
The ATS-11A-138-C2-R0 heat sink can be used in a wide variety of applications, including industrial electronics, telecommunications, automotive, medical, and consumer electronics. It is ideal for cooling CPUs, GPUs, and other high-power electronic components that require efficient thermal management. The C2-R0 is also suitable for use in high-end servers and avionics equipment due to its high-grade construction and superior thermal transfer technology.
The working principle of the ATS-11A-138-C2-R0 is simple yet effective. Its multi-layer construction consists of thin-film layers with unique textures and air gaps that promote efficient thermal performance. When an electronic component gets hot, thermal energy is absorbed into the heat sink, where it is distributed evenly and efficiently throughout the heat sink using the multi-layer and air gap design. The heat is then dissipated away from the electronic component to cool it down and keep it from getting too hot.
In addition to its excellent thermal management capabilities, the ATS-11A-138-C2-R0 also offers a few other advantages. Its durable aluminum construction ensures that it is designed to last, making it a cost-effective and reliable choice for any long-term cooling solution. The C2-R0 is also incredibly easy to install, saving time and money during the installation process. Lastly, the heat sink is small and highly compact, allowing it to easily fit into any space-constrained system.
The ATS-11A-138-C2-R0 is a high-performance, cost-effective thermal heat sink from ATS that provides superior thermal management solutions for a wide variety of applications. Its multi-layer design consists of thin-film layers and air gaps that allow for efficient heat transfer. In addition to being easy to install, the C2-R0 is highly reliable and can handle up to 50°C temperatures. With its excellent thermal performance and durable construction, the ATS-11A-138-C2-R0 heat sink is an ideal choice for any cooling requirement.
The specific data is subject to PDF, and the above content is for reference