ATS-11A-14-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11A-14-C1-R0-ND

Manufacturer Part#:

ATS-11A-14-C1-R0

Price: $ 3.68
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X20MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11A-14-C1-R0 datasheetATS-11A-14-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.34026
30 +: $ 3.25017
50 +: $ 3.06974
100 +: $ 2.88912
250 +: $ 2.70857
500 +: $ 2.61828
1000 +: $ 2.34741
Stock 1000Can Ship Immediately
$ 3.68
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.790" (20.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.96°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-11A-14-C1-R0 thermal-heat sink from ATS Thermal Management is an optimal choice for industrial cooling, data center cooling, and air conditioning systems. The model’s slim design enables it to blend in aesthetically with surrounding components, and its smooth surface makes it easier to clean, as well as helping to reduce fatigue caused by persistent vibrations.

The ATS-11A-14-C1-R0 thermal-heat sink is designed with several features to increase its effectiveness and make the device easier to incorporate into existing setups. The aluminum base is anodized and offers superior thermal conductivity, making it easier to dissipate heat. It comes with an anodized black coating application, which enhances the heat transfer response. The device also has an EasyLock attachment, which allows for quick and easy installation, as well as a protective coating to help minimize corrosion.

The ATS-11A-14-C1-R0 thermal-heat sink is equipped with a thermoelectric module that provides accurate temperature control. This module enables the device to maintain a desired temperature range, making it an ideal choice for temperature sensitive components, such as CPUs, GPUs, and other sensitive components. The thermoelectric module also helps conserve energy by allowing the device to remain cooler during periods of inactivity, ensuring that energy is not wasted.

The device is also designed with integrated cooling fins that help to dissipate the heat generated by components in the system. This type of cooling is essential for components that generate large amounts of heat, such as CPUs and GPUs. The fins are also designed to reduce air turbulence during cooling, resulting in greater efficiency.

The ATS-11A-14-C1-R0 thermal-heat sink offers a variety of important advantages. Its slim design and anodized black coating make it an ideal choice for any system where aesthetics and optimal cooling are important considerations. The thermoelectric module allows for accurate temperature control and efficient power usage, while the integrated cooling fins help to improve cooling performance and reduce air turbulence. All of these features make the ATS-11A-14-C1-R0 thermal-heat sink an ideal choice for nearly any application.

The specific data is subject to PDF, and the above content is for reference

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