| Allicdata Part #: | ATS18537-ND |
| Manufacturer Part#: |
ATS-11A-142-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-142-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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A thermal - heat sink, often also called a heat sink, is a vital component of a computer system, or any other electronic device. The purpose of a heat sink is to dissipate the heat generated by the processor or other components, helping to keep the system running at optimal temperatures. The ATS-11A-142-C2-R0 heat sink is a reliable and robust product specifically designed for high-efficiency heat transfer from component to ambient air. This article will provide a brief overview of some of the applications and principles of the ATS-11A-142-C2-R0 heat sink.
ATS-11A-142-C2-R0 Application Fields
The ATS-11A-142-C2-R0 heat sink is designed for use in a wide range of applications, including high-end gaming PCs, as well as industrial and embedded systems. With its large surface area and high-performance thermal design, the heat sink is ideal for dissipating heat efficiently away from potentially sensitive components, helping to protect them from damage. The design also allows for the cooling fins to be spaced far apart, giving a larger overall surface area and therefore, increasing heat dissipation even further.
The heat sink can also be used to cool a range of other components, including graphics cards, as well as CPUs, north bridges, and storage devices. With its strong construction and excellent thermal performance, the heat sink is highly suitable for use in many types of system builds, offering a reliable and long-lasting cooling solution.
ATS-11A-142-C2-R0 Working Principle
The working principle of the ATS-11A-142-C2-R0 heat sink is fairly straightforward. It consists of a series of cooling fins, arranged in a line or with gaps between them. These fins provide a large surface area which is exposed to the air, resulting in a high rate of heat dispersion. The heat is transferred from the component to the fins, and then dissipated into the air.
To ensure the best possible heat transfer, the heat sink should be installed correctly. This involves ensuring that the heat sink is firmly seated against the component and that there are no gaps between the component and the heat sink. The fins should also be spread apart and should be exposed to an unrestricted airflow, as this will ensure that heat is dispersed quickly and effectively.
Conclusion
The ATS-11A-142-C2-R0 heat sink is perfect for a wide range of applications, due to its robust construction and excellent heat dissipation. With its large surface area and carefully designed cooling fins, the heat sink is ideal for ensuring that components remain within optimal temperature limits. Therefore, it can help to ensure the longevity and reliability of many electronics systems.
The specific data is subject to PDF, and the above content is for reference