ATS-11A-15-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS18545-ND

Manufacturer Part#:

ATS-11A-15-C2-R0

Price: $ 4.52
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 50X50X25MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11A-15-C2-R0 datasheetATS-11A-15-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.11390
10 +: $ 4.00239
25 +: $ 3.77975
50 +: $ 3.55748
100 +: $ 3.33509
250 +: $ 3.11275
500 +: $ 2.89041
1000 +: $ 2.83483
Stock 1000Can Ship Immediately
$ 4.52
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.969" (50.00mm)
Width: 1.969" (50.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.44°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

Heat sinks are essential components utilized to dissipate thermal energy away from devices, boards, and assemblies. To enable efficient heat transfer from heat sources into ambient air, the heat sinks must be designed with a clever combination of physical and fluid dynamics principles. The widely used ATS-11A-15-C2-R0 heat sink, is an outstanding example of such a device.

ATS-11A-15-C2-R0 Application Field

The ATS-11A-15-C2-R0 is one of the most widespread heat sinks, and it has multiple applications. Notably, it is used in high temperature environments, such as computer processors, electric motors, and power converters. It is also designed for use in tough conditions, such as highest shock, vibration, and temperature, which occur in some military and aerospace applications. In addition, this popular heat sink is also suitable for medical, automotive, and electronic devices.

Working Principle and Design

The ATS-11A-15-C2-R0 is a sophisticated heat sink featuring a copper base and aluminum extruded fins. It has a cleverly engineered design to maximize the surface area of both the base and the fins. It also features an air-flow channel to direct the air along the heat sink fins and efficiently cool the device being cooled. The heat from the device being cooled is transferred away from it by conduction, and then dissipated by convection. It achieves this by using an area of raised metal on the heat sink base which maximizes the surface area. The fins act to direct the air through the air-flow channel, and the increased surface area enhances the rate of heat exchange.

The ATS-11A-15-C2-R0 also features a unique variable stress-relief design. This innovative design ensures that any thermal stress is evenly distributed. This prevents cracking or deformation of the heat sink due to thermal fatigue. This innovative design also ensures that the device is able to withstand intense shocks and vibrations.

Conclusion

The ATS-11A-15-C2-R0 is an advanced and reliable heat sink for use in a variety of industries. Its cleverly engineered physical and fluid dynamics principles maximize the heat transfer from a device being cooled to the surrounding air. Its variable stress-relief design ensures that the device is able to withstand intense shocks and vibrations, which makes it suitable for many industrial applications. Its myriad of features make the ATS-11A-15-C2-R0 one of the most popular heat sinks on the market.

The specific data is subject to PDF, and the above content is for reference

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