| Allicdata Part #: | ATS-11A-155-C3-R0-ND |
| Manufacturer Part#: |
ATS-11A-155-C3-R0 |
| Price: | $ 4.08 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-155-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.71322 |
| 30 +: | $ 3.50658 |
| 50 +: | $ 3.30044 |
| 100 +: | $ 3.09412 |
| 250 +: | $ 2.88784 |
| 500 +: | $ 2.68157 |
| 1000 +: | $ 2.63000 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.47°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management technology plays a vital role in the successful operation of a wide range of electronics. The ATS-11A-155-C3-R0 thermal heat sink is an advanced cooling system that provides robust performance in a variety of applications. This article will discuss the application field and working principle of the ATS-11A-155-C3-R0.
The ATS-11A-155-C3-R0 heat sink utilizes a mass-produced aluminum finned profile and employs an efficient design with an improved radiative surface. It features a large fin area with a high conductivity and an optimized low profile housing. This results in higher thermal efficiency and helps provide an optimal operating environment for a variety of applications.
An important application field of the ATS-11A-155-C3-R0 is telecommunications. This is because the heat sink is able to dissipate the heat generated from the telecom devices. The large fin area of the heat sink allows for better heat dissipation. This improves the performance of the telecom equipment, resulting in better signal quality and less interference.
The ATS-11A-155-C3-R0 can also be used in medical device applications. With the efficient design and improved radiative surface of the heat sink, it can help to ensure reliable and effective operation of medical devices. The improved thermal efficiency of the heat sink prevents any overheating of the medical devices. This helps to provide both safety and efficiency.
The ATS-11A-155-C3-R0 thermal heat sink also finds application in the automotive industry. Its mass-produced aluminum finned profile and efficient design can help reduce the noise and vibration of engines. As a result, the engine operates smoother and more efficiently and provides a comfortable driving experience.
The working principle of the ATS-11A-155-C3-R0 thermal heat sink utilizes both finned construction and radiative surfaces. The finned construction allows for effective heat dissipation. This provides optimal cooling capabilities. The radiative surface of the heat sink helps to transfer the heat from the components to its fins, allowing for more efficient cooling.
The aluminum fins of the heat sink also act as a heat spreader. This means that the heat is evenly distributed throughout the sink, preventing any localized hotspots or over-heated areas. The heat sink also features an optimized air flow, helping to increase its cooling capabilities.
Overall, the ATS-11A-155-C3-R0 thermal heat sink is capable of providing robust performance in a wide variety of applications. This includes the telecommunications, medical device, and automotive industries. Furthermore, the efficient design and improved radiative surfaces of the heat sink ensure reliable and effective operation of these applications. It also helps reduce noise and vibration of engines, providing a more comfortable driving experience.
The specific data is subject to PDF, and the above content is for reference