| Allicdata Part #: | ATS18568-ND |
| Manufacturer Part#: |
ATS-11A-170-C2-R0 |
| Price: | $ 3.84 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-170-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.49020 |
| 10 +: | $ 3.40011 |
| 25 +: | $ 3.30800 |
| 50 +: | $ 3.12430 |
| 100 +: | $ 2.94052 |
| 250 +: | $ 2.75675 |
| 500 +: | $ 2.66487 |
| 1000 +: | $ 2.38918 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.07°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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ATS-11A-170-C2-R0 is an advanced thermal management heat sink from a top thermal solutions provider. It is ideal for applications where maximum cooling performance is required, such as computer data centers, HVAC and refrigeration systems, and other commercial and industrial electronic applications. In this article, we will discuss the application field and working principle of ATS-11A-170-C2-R0.
The ATS-11A-170-C2-R0 provides high-performance active heat sink cooling performance designed to dissipate large amounts of heat in temperatures up to 140C. This makes it perfect for mission-critical applications that demand high-performance cooling solutions. Additionally, the ATS-11A-170-C2-R0 provides excellent thermal conductivity, ensuring efficient thermal energy transfer from the source to the heat sink.
The ATS-11A-170-C2-R0 is designed for use in a variety of applications, from industrial and commercial electronics to computer systems. It can be used to cool motherboards, processors, power supplies, and other heat-generating components. Its large surface area allows for effective heat dissipation and ensures reliable and consistent cooling performance.
The ATS-11A-170-C2-R0 works on a closed-loop active heat sink design. This means that a fan-driven, cold side plate is connected to a hot side plate. The cold side plate draws in hot air and exchanges heat with the hot side plate. This heat transfer process is repeated over and over again, resulting in a stable and uninterrupted cooling performance. The fan-driven design ensures high air flow through the heat sink, ensuring maximum heat dissipation.
Additionally, the ATS-11A-170-C2-R0 utilizes a unique fin design for improved heat conductivity. This fin design is optimized to maximize heat dissipation, while minimising temperature resistance. The fins are designed to provide maximum surface area whilst still being lightweight and robust. This ensures a high-performance, efficient heat transfer from the heat source to the heat sink.
The ATS-11A-170-C2-R0 also utilizes an innovative airflow management system to help reduce air resistance and increase airflow. This ensures that airflows remain smooth and consistent, further enhancing heat dissipation and cooling performance. Additionally, the cooling system is coupled with intelligent thermal sensors to monitor temperatures and adjust cooling performance accordingly.
Overall, the ATS-11A-170-C2-R0 is a superior thermal management solution suitable for a wide variety of applications. Its high-performance active heat sink design provides reliable and efficient cooling performance, whilst its innovative airflow management system ensures that airflows remain stable and consistent. Its fin design further enhances heat conductivity, enabling maximum heat dissipation in extreme temperatures. With all these features, the ATS-11A-170-C2-R0 is an ideal thermal management solution for a variety of industrial and commercial applications.
The specific data is subject to PDF, and the above content is for reference