| Allicdata Part #: | ATS-11A-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-11A-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for today\'s electronic devices, since heat limiting their performance and reliability. Heat sinks provide a cost-effective and energy-efficient way to dissipate heat. The ATS-11A-20-C1-R0 is a popular thermal-heat sink with a maximum temperature of 75 degrees Celsius and a heat transfer rate of 11 watts. In this article, we will discuss the application field and working principle of the ATS-11A-20-C1-R0 thermal-heat sink.
Application Field
The ATS-11A-20-C1-R0 thermal-heat sink has a wide range of applications in many industries. It is primarily used in high-performance computing, telecommunications, medical electronics, automotive electronics, and consumer electronics. This thermal-heat sink is designed to dissipate heat from high-power ASICs, digital signal processors, microprocessors, and FPGAs. It can also be used in high-power LED lighting, electric motor drive electronics, industrial process control equipment, and electrically powered vehicle systems.
Due to its excellent thermal conductivity, high-heat capacity, and light weight, the ATS-11A-20-C1-R0 is an ideal choice for applications that require both energy-efficiency and effective thermal management. This thermal-heat sink is compatible with multiple components, making it suitable for a wide range of applications.
Working Principle
The ATS-11A-20-C1-R0 thermal-heat sink uses the principle of heat transfer to dissipate heat from electronic components. It consists of a series of aluminum fins that are designed to act as heat exchangers, drawing in heat from electronic components and efficiently dissipating it into the surrounding environment. When the fins come into contact with the component, the heat is drawn in and dissipated through the fins by conduction and convection.
The highly efficient diamond grooves on the ATS-11A-20-C1-R0 thermal-heat sink further increase its heat transfer rate. These grooves create more surface area, allowing more heat to be transferred away from the component. The fins are also designed to maximize the flow of air, further enhancing the thermal management performance.
Conclusion
The ATS-11A-20-C1-R0 thermal-heat sink is a highly effective and energy-efficient solution for thermal management. It is suitable for a wide range of applications, and its thermal management capabilities are further improved by its diamond grooves and air flow design. It\'s no wonder the ATS-11A-20-C1-R0 is one of the most popular thermal-heat sinks on the market today.
The specific data is subject to PDF, and the above content is for reference