| Allicdata Part #: | ATS-11A-20-C3-R0-ND |
| Manufacturer Part#: |
ATS-11A-20-C3-R0 |
| Price: | $ 4.67 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-20-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.19895 |
| 30 +: | $ 3.96543 |
| 50 +: | $ 3.73225 |
| 100 +: | $ 3.49896 |
| 250 +: | $ 3.26570 |
| 500 +: | $ 3.03243 |
| 1000 +: | $ 2.97412 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.21°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of efficient electronics. Heat sinks are commonly used to promote convective and radiative heat transfer away from hot components to improve the overall performance and life expectancy of the components. Heat sinks are used in a variety of different industrial, consumer, automotive, and medical applications, including ATS-11A-20-C3-R0.
The ATS-11A-20-C3-R0 heat sink is a product of Advance Thermal Solutions. This heat sink is specifically designed for general purpose applications, such as data processing and telecommunications. The ATS-11A-20-C3-R0 is constructed with an aluminum finned body, a copper base plate for increased thermal conductivity, and a single-sided, integrated, high-performance fan.
The mechanical characteristics of the ATS-11A-20-C3-R0 heat sink include a fan size of 120 x 25 mm (4.72 x 0.98 inches), an overall size of 160 x 130 x 105 mm (6.3 x 5.12 x 4.13 inches), and a mounting hole size of 4.5 mm (0.18 inches). The fan operates between 12 VDC and 24 VDC supply voltages and has a speed range of 1500 to 3000 RPM. The ATS-11A-20-C3-R0 heat sink has a thermal resistance of 0.14 C/W at a velocity of 80 LFM. Other features of the ATS-11A-20-C3-R0 include a maximum temperature rating of 100 C (212 F), a noise level of 31 dBA,a lifespan of 50,000 hours at 40 C, and the RoHS marks.
The main working principle behind the ATS-11A-20-C3-R0 heat sink is to regulate heat transfer away from hot components while efficiently cooling the device. The heatsink contains a thin aluminum finned body, a copper base plate, and the integrated fan. The thin aluminum finned body has a large surface area which can absorb heat from the hot components located underneath the device. The copper baseplate is for increased thermal conductivity, and the fan draws in the air around the heat sink, creating a convective current. This helps push the heat away from the device and towards the environment, and thus dissipates the heat.
The thermal performance of the ATS-11A-20-C3-R0 heat sink is excellent and can handle heat from several hot components. As a result, it is well-suited for applications such as data processing, telecommunications, consumer electronics, and medical equipment. It can also be used to assist processors, controllers, and other computer-based devices where thermal solutions are required. In addition, the ATS-11A-20-C3-R0 can also be used for cooling various components in industrial and automotive applications.
The ATS-11A-20-C3-R0 heat sink is a reliable and effective way to manage thermal problems that are commonly confronted by many electronics devices. It offers excellent thermal performance, and its innovative design ensures superior airflow and a quiet operation. Furthermore, the ATS-11A-20-C3-R0 is RoHS compliant and thus environmentally friendly. All in all, this heat sink from Advanced Thermal Solutions is a great choice for a variety of thermal management applications.
The specific data is subject to PDF, and the above content is for reference