ATS-11A-23-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11A-23-C1-R0-ND

Manufacturer Part#:

ATS-11A-23-C1-R0

Price: $ 4.24
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11A-23-C1-R0 datasheetATS-11A-23-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.81717
30 +: $ 3.60507
50 +: $ 3.39293
100 +: $ 3.18087
250 +: $ 2.96881
500 +: $ 2.75675
1000 +: $ 2.70374
Stock 1000Can Ship Immediately
$ 4.24
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is an important factor in ensuring the safe and efficient operation of many electrical applications. Heat sinks are important components of these thermal management systems, and the ATS-11A-23-C1-R0 is one of the most reliable and effective options available. This heat sink works by transferring excess heat away from critical components by using its aluminum body and high-efficiency fin construction to rapidly dissipate large amounts of heat away from the source.

The ATS-11A-23-C1-R0 has a large radiating area that helps to quickly cool components by providing a large surface area for heat to be transferred away from high-temperature areas. This design also works by utilizing air movements and natural convection, allowing hot air to escape quickly while cooler air is allowed to enter. Additionally, the heat sink is anodized, which helps to prevent oxidation and degradation. This ensures the thermal management efficiency of the ATS-11A-23-C1-R0 remains consistent over time, even in heavily corrosive environments.

The ATS-11A-23-C1-R0 is incredibly versatile and can be adapted to almost any thermal management needs. It can handle high power outputs of up to 0.8 amps, and its performance increases with greater power outputs. It is also compatible with the latest electronic components for wear-resistant, advanced protection. The ATS-11A-23-C1-R0 is designed to meet international AC requirements, underwriters laboratories (UL), cUL, and other safety standards. This makes it suitable for a wide range of applications such as computer systems, communication components, power supplies, laptops, automotive electronics, circuit boards, and more.

The ATS-11A-23-C1-R0 has a simple installation and requires minimal maintenance. It comes with a pressure sensitive adhesive and a thermal-compensated dual clamp for secure mounting. It also features self-levelling foot mounts that adjust to the mounting surface, allowing for a stronger grip. The heat sink can be easily removed and replaced when needed, reducing time and effort. The unit is also small enough to fit in tight housing units and is lightweight, making it ideal for compact and portable applications.

The ATS-11A-23-C1-R0 is ideal for applications that require a high degree of cooling efficiency and reliable performance. Its adjustable mount and compact size make it ideal for a wide variety of thermal management solutions, and its anodized aluminum body and high-efficiency fins provide an excellent thermal conductivity. With its versatile design and reliable performance, the ATS-11A-23-C1-R0 is an excellent choice for efficient thermal management.

The specific data is subject to PDF, and the above content is for reference

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