| Allicdata Part #: | ATS-11A-46-C1-R0-ND |
| Manufacturer Part#: |
ATS-11A-46-C1-R0 |
| Price: | $ 3.28 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-46-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.98368 |
| 30 +: | $ 2.90325 |
| 50 +: | $ 2.74201 |
| 100 +: | $ 2.58067 |
| 250 +: | $ 2.41940 |
| 500 +: | $ 2.33875 |
| 1000 +: | $ 2.09680 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal Management plays an important role in the familiar everyday products. From laptops to cars, products must be able to stay at a manageable temperature to ensure that they work correctly and their parts don’t break down prematurely. One important part of Thermal Management is Heat Sinks.
A Heat Sink is a device that helps to transfer heat away from an object or component to a different area. It does this by collecting the heat from the component and radiating it away via radiation, convection, or conduction.
An ATS-11A-46-C1-R0 is a type of Heat Sink that can be used to manage heat away from various components. It is a die-stamped aluminum Heat Sink with fin-like projections which help to increase the surface area contact with the air and allow increased dissipation of heat. This Heat Sink also has a pin header which facilitates connection to other components.
The ATS-11A-46-C1-R0 can be used in a variety of applications requiring Heat Sink technology. These include applications requiring high power components, such as power amplifiers, power ICs and microprocessors. It can also be used to cool components in consumer electronics, as well as for medical electronics.
The ATS-11A-46-C1-R0 is designed to dissipate heat away from the component via convection. The aluminum die-stamping process provides an increase in surface area and increases the contact area between the Heat Sink and air, allowing the heat to be rapidly dissipated. The Heat Sink is also designed with a ‘pin header’ which helps to ensure that the Heat Sink is securely connected to the component.
The ATS-11A-46-C1-R0 has been designed to meet the thermal requirements of various applications. It is tested to ensure that the Heat Sink reaches the proper temperature quickly and evenly. It also meets ESD and ICT testing requirements.
Overall, the ATS-11A-46-C1-R0 is a great example of Heat Sink technology. It provides excellent thermal solutions for a variety of applications, and is designed to meet the strictest of thermal requirements.
The specific data is subject to PDF, and the above content is for reference