| Allicdata Part #: | ATS-11A-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-11A-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are widely used in the electronics industry. They serve to dissipate heat generated by electronic components, such as processors, integrated circuits, and transistors. The ATS-11A-63-C1-R0 and B heat sinks are a product of Advanced Thermal Solutions, Inc. These thermal-heat sinks are manufactured for applications where thermal management and energy efficiency are paramount.
ATST-11A-63-C1-R0 and B heat sinks offer efficient cooling for electronics due to their shape and material composition. The aluminum fins are arranged in a staggered design, which maximizes total surface area. This helps to improve air flow between the fins, allowing more heat to be dissipated. In addition, the heatsink fins are constructed from aluminum that is lightweight, strong, and resistant to corrosion.
The ATS-11A-63-C1-R0 and B heat sinks can be utilized in a variety of electronic cooling applications. For example, they are well-suited for cooling graphic cards, power supplies, and other devices that generate a lot of heat. Since they are light and compact in design, they can be placed in most electronic systems without taking up a lot of space.
The ATS-11A-63-C1-R0 and B heat sinks work by transferring the generated heat from the surface of the component to the air. This process is accomplished by absorbing heat from the component, which is then transferred to the surrounding atmosphere. The fins then act as a radiator, dissipating the heat into the atmosphere.
In order to ensure optimal performance, the ATS-11A-63-C1-R0 and B heat sinks should be properly installed. This requires mounting the heatsink on the component and connecting it to a power source. Once connected, the heatsink should be secured in place with screws or bolts. Once the installation is complete, the heatsink should be tested to ensure it is working correctly.
The ATS-11A-63-C1-R0 and B heat sinks are an ideal choice for cooling electronics. They are lightweight and compact in design, yet still offer efficient heat dissipation. Furthermore, they are easy to install and require only a simple connection to a power source for optimal performance.
The specific data is subject to PDF, and the above content is for reference