| Allicdata Part #: | ATS-11A-64-C3-R0-ND |
| Manufacturer Part#: |
ATS-11A-64-C3-R0 |
| Price: | $ 4.35 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: | ATS-11A-64-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.92112 |
| 30 +: | $ 3.70335 |
| 50 +: | $ 3.48541 |
| 100 +: | $ 3.26762 |
| 250 +: | $ 3.04978 |
| 500 +: | $ 2.83194 |
| 1000 +: | $ 2.77748 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.49°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-11A-64-C3-R0 is a commonly used thermal management solution, typically used for heat sinks. This type of thermal management solution uses an advanced heatsink design to efficiently dissipate heat away from electronic components. By dissipating heat away from the components, it improves the overall performance and reliability of the components. This article will provide an overview of the ATS-11A-64-C3-R0 application field and working principle.
Application field
The ATS-11A-64-C3-R0 is often used in applications where high performance and reliability are paramount. These applications often require efficient thermal management solutions to maintain high-end computer or server systems. As such, the ATS-11A-64-C3-R0 is designed to provide cooling to a wide range of components, including CPUs, GPUs, RAM, and other components.
The ATS-11A-64-C3-R0 is also widely used in industrial and automotive applications. These applications often require efficient thermal management solutions to maintain operation within required temperature parameters. The ATS-11A-64-C3-R0 is able to effectively dissipate heat away from control systems, HVAC systems, and other sensitive electronic systems.
Working principle
The working principle of the ATS-11A-64-C3-R0 is based on a set of advanced heatsink design features. These features include an integrated fin array, a patented fin-arc shape, and advanced air cooling technologies. The fin array is designed to create a larger surface area for the air to contact, thus improving the heat dissipation capabilities of the heatsink.
The fin-arc shape is designed to maximise the cooling performance of the heatsink by enhancing the air movement through the fins. The advanced air cooling technologies used in the ATS-11A-64-C3-R0 are designed to maximise the air flow to the surface of the fins for more efficient heat dissipation. The combination of these features allows the ATS-11A-64-C3-R0 to dissipate heat away from electronic components at a faster rate than traditional heatsinks.
Conclusion
The ATS-11A-64-C3-R0 is a commonly used thermal management solution, typically used for heat sinks. By dissipating heat away from the components, it improves the overall performance and reliability of the components. The ATS-11A-64-C3-R0 works by using an integrated fin array, a patented fin-arc shape, and advanced air cooling technologies to maximise the air flow to the surface of the fins for more efficient heat dissipation. In conclusion, the ATS-11A-64-C3-R0 offers a powerful and efficient thermal management solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference
ATS-11A-64-C3-R0 Datasheet/PDF