| Allicdata Part #: | ATS-11A-73-C1-R0-ND |
| Manufacturer Part#: |
ATS-11A-73-C1-R0 |
| Price: | $ 3.13 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X10MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11A-73-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.81736 |
| 30 +: | $ 2.74134 |
| 50 +: | $ 2.58905 |
| 100 +: | $ 2.43671 |
| 250 +: | $ 2.28446 |
| 500 +: | $ 2.20830 |
| 1000 +: | $ 1.97985 |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 28.78°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
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Thermal management plays a vital role in the safe and efficient operation of most electronic components. As such, it is important to have efficient heat sink components that can dissipate heat away from an electronic component, allowing it to operate at optimal temperatures. The ATS-11A-73-C1-R0 heat sink is a reliable and efficient heat sink solution and is widely used in many different applications.
The ATS-11A-73-C1-R0 heat sink is made from high-grade aluminum alloy that is designed to provide excellent heat dissipation. In addition, the heat sink includes a series of fins that help to promote increased airflow and cooling. The combination of the aluminum alloy and the fin design ensures that the heat sink is able to effectively and efficiently dissipate heat from the electronic components.
The working principle of the ATS-11A-73-C1-R0 heat sink is simple yet effective. Heat is first transferred from the electronic component to the heat sink via conduction. The heat sink absorbs the heat and then the fins promote the circulation of cool air around the heat sink. As the air is circulated, it helps to dissipate the heat away from the electronic component and into the atmosphere.
The ATS-11A-73-C1-R0 heat sink is suitable for a wide range of applications. It is widely used in the automotive, computer, aerospace, and medical industries, as well as in a variety of other applications. The heat sink is ideal for automotive and computer applications as it provides reliable cooling solutions for these components. In addition, the heat sink is also suitable for high-power applications as it is able to effectively move and dissipate large amounts of heat.
The ATS-11A-73-C1-R0 heat sink is also suitable for applications in electronic devices and equipment that require high-power operations. The heat sink is able to reduce the temperature of these components and ensure efficient operation. Additionally, the ATS-11A-73-C1-R0 heat sink is also ideal for industrial applications, such as high voltage power supplies, as the efficient heat dissipation can help prolong the life of the components.
The ATS-11A-73-C1-R0 heat sink is an efficient and reliable heat sink solution for many different applications. Its simple yet effective working principle makes it suitable for a variety of applications, including automotive, computer, aerospace, and medical industries. The high-grade aluminum alloy and fin design ensure that the heat sink is able to effectively and efficiently dissipate heat away from the components, allowing for optimal temperatures and functioning of the electronic components.
The specific data is subject to PDF, and the above content is for reference