ATS-11A-80-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11A-80-C1-R0-ND

Manufacturer Part#:

ATS-11A-80-C1-R0

Price: $ 3.25
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 30X30X15MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11A-80-C1-R0 datasheetATS-11A-80-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.94840
30 +: $ 2.86860
50 +: $ 2.70925
100 +: $ 2.54986
250 +: $ 2.39047
500 +: $ 2.31079
1000 +: $ 2.07174
Stock 1000Can Ship Immediately
$ 3.25
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.181" (30.00mm)
Width: 1.181" (30.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are tools used to transfer heat produced by CPU and other devices to the ambient air. The ATS-11A-80-C1-R0 heat sink is an excellent example of this tool and is designed for use in a variety of application fields. The working principle of this type of heat sink is discussed in this article, as well as the primary application fields for the ATS-11A-80-C1-R0.

The working principle of the ATS-11A-80-C1-R0 heatsink is quite simple and effective. It is composed of a main body, fins, and pins. The main body is designed to dissipate heat from the CPU or other device, while the fins and pins are used to transfer the heat to the ambient air. This type of heat sink is designed to be placed directly onto the CPU, where it can dissipate the large amounts of heat produced by the processor. The efficiently designed fins and pins ensure that maximum heat transfer can be achieved, cooling the CPU, or other device, quickly and effectively.

The ATS-11A-80-C1-R0 heatsink is designed for a variety of applications. It is commonly used in industrial contexts, for controlling the temperature of space-constrained systems, such as those utilized in aerospace environments. It can also be used in consumer electronics, such as laptops, tablets, and other devices. Additionally, the ATS-11A-80-C1-R0 has been proven to be highly effective in laboratory and medical environments, as well as gaming applications.

In addition to the thermal management solutions provided by the ATS-11A-80-C1-R0, the heatsink offers a number of other advantages. It is a low cost solution, as well as being an incredibly energy-efficient choice. The low power requirements for this type of heat sink allow it to be used in a variety of applications, including those in which power consumption must be kept to a minimum. Additionally, the lightweight construction and compact design of this type of heatsink makes it ideal for applications in which space is limited.

The ATS-11A-80-C1-R0 is an incredibly efficient, energy-saving heat sink solution, which can be used in a variety of application fields. Its main body and pins are designed to efficiently dissipate and transfer heat, respectively, providing excellent cooling performance. Moreover, it is a low-cost and low-power solution that is lightweight and compact, making it ideal for space-constrained systems. This type of heat sink is perfect for industrial, consumer electronics, gaming, laboratory, and medical application fields.

The specific data is subject to PDF, and the above content is for reference

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