ATS-11A-93-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.575" (40.00mm)
Width:	1.575" (40.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	12.42°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

ATS-11A-93-C3-R0 is a type of thermal - heat sink designed to dissipate heat from electronic components such as transistors, ICs, microcontrollers and so forth. Heat sinks are an essential part of many applications, with their ability to efficiently conduct heat from the component to the surrounding environment. A heat sink consists of a large block of metal with fins attached to provide a greater surface area, and thus more efficient heat dissipation.

Application

ATS-11A-93-C3-R0 is used in electronic devices and systems such as computers, which require efficient heat dissipation to maintain optimal performance and prevent risks of overheating. Due to its efficient thermal conduction capabilities and large surface area, this type of heat sink has the ability to effectively cool components and devices— ensuring that it is suited for resources-intensive projects such as supercomputing and data centers. Additionally, this type of heat sink is also ideal for use in other high-performance applications such as automotive, military, and aerospace.

Methods

Heat sinks with a high thermal transfer coefficient are ideal for dissipating heat efficiently, and the ATS-11A-93-C3-R0 was designed to provide optimum temperature and thermal control. The heat sink\'s ability to effectively transfer heat between parts is due to its combination of thermally conductive and thermally insulating materials, which ensures the efficient transfer of heat between the component or device and the surrounding air. To further encourage effective heat dissipation, the fins of the heat sink use the natural convection process of air to maximize air movement and cool the component or device more quickly.

Installation

Installation of the ATS-11A-93-C3-R0 is relatively simple, and can be performed quickly. Massive metal components, usually made from aluminum or copper, can be easily mounted and secured with the appropriate screws and hardware. Once installed, users can expect a secure connection between the heat sink and the component or device, allowing for effective heat transfer while preventing potential damage from being caused by possible vibrations.

Maintenance

Given that proper maintenance can help maintain the effectiveness of heat sinks over an extended period of time, manufacturers of the ATS-11A-93-C3-R0 provide useful information on how to care for the device. For example, users are advised to use a cloth or soft brush to clean the heat sink, being very careful not to damage or break the fin surfaces. Furthermore, removing foreign objects like dirt and dust, as well as replacing any broken parts, are required to ensure maximum effectiveness.

Conclusion

The ATS-11A-93-C3-R0 is a thermal - heat sink designed to efficiently cool electronic components and aid in applications where temperatures must be maintained. This type of heat sink is capable of efficiently transferring heat, thanks to its combination of thermally conductive and thermally insulating materials, and its large surface area ensures that the component and the surrounding environment remain at ideal temperatures. Though the installation process is relatively simple, proper maintenance and cleaning are recommended in order to ensure optimal performance over an extended period of time.

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