| Allicdata Part #: | ATS-11B-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management can be a tricky job; when dealing with components that generate a lot of heat, it can be quite difficult to properly regulate temperatures. There are many components and systems that are designed to help manage thermal requirements, and the ATS-11B-10-C1-R0 is one of them. This component is designed specifically for thermal management applications, and understanding its features and functions can be integral to the proper management of temperatures.
The ATS-11B-10-C1-R0 is part of a family of heat sinks designed for managing thermal requirements. These heat sinks are designed to absorb and dissipate heat that is generated within an electronic system. The ATS-11B-10-C1-R0 comes with an optimized pin fin pattern which provides a higher level of thermal conduction than other similar components, and it also includes wider pin widths which further increases its thermal efficiency. This unique combination of features allows the ATS-11B-10-C1-R0 to offer superior performance in comparison to other components of its type.
In terms of its application field, the ATS-11B-10-C1-R0 is ideally suited for applications where extremely efficient thermal management is necessary. Some of the areas in which this component may be particularly well suited include power electronics, motor control systems, communications, and medical electronics. It can also be used in other applications where heat must be properly dissipation from a component or system in an effective and efficient manner.
In terms of its working principle, the ATS-11B-10-C1-R0 utilizes a combination of features to absorb and dissipate heat in an effective manner. The first is its optimized pin fin pattern which allows for efficient thermal conduction. The second is the pin width which increases the thermal efficiency. Lastly, the component has an effective top plate design which helps to further enhance the heat sink’s effectiveness. These features act to draw heat away from the component or system, and dissipate it in a way that will ensure the system operates safely.
In conclusion, the ATS-11B-10-C1-R0 is an ideal choice for applications that require efficient thermal management. Its optimized pin fin pattern, wider pin widths, and effective top plate design give it a performance edge over other similar heat sinks. Therefore, it can be an effective solution for applications in which proper thermal management is a must.
The specific data is subject to PDF, and the above content is for reference