| Allicdata Part #: | ATS18688-ND |
| Manufacturer Part#: |
ATS-11B-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices that absorb thermal energy and dissipate it, providing heat to control internal temperatures in a variety of applications. The ATS-11B-10-C2-R0 application field and working principle is one example of this technology.
ATS-11B-10-C2-R0 is an advanced fin heat sink, increasing the industrial design flexibility and performance while reducing the total cost of ownership. It has a highly efficient thermal heat dissipation system of 40W, while its high static pressure fan ensures that this heat is dissipated quickly and effectively. Additionally, the ATS-11B-10-C2-R0 features a unique multiple fin array design, which allows it to dissipate greater amounts of heat than other heat sinks.
The ATS-11B-10-C2-R0 works by transferring heat from a central thermostatic device, such as a CPU, GPU, or memory chip, to the ambient air. Its fin array design allows the heat to be spread over multiple fins simultaneously. This spreading of heat helps reduce the ambient air’s temperature around the thermal device, thereby maintaining the device’s optimal temperature.
The ATS-11B-10-C2-R0 is designed to handle temperatures both below and above ambient,making it suitable for a range of applications. It is an excellent choice for heat dissipation in devices such as servers, laser printers, drones, embedded systems, and 3D printers. Additionally, the ATS-11B-10-C2-R0 can be used for industrial automation processes, such as in the food and beverage industry or cleanroom environments.
The ATS-11B-10-C2-R0 is easy to install and requires no additional components. Its construction features a durable aluminum alloy, and its circuit board uses high-quality materials. Its built-in high-speed fan ensures optimal operation of the device and provides long-term durability and reliability. Furthermore, its state-of-the-art design ensures effective thermal management while also reducing noise.
The ATS-11B-10-C2-R0 is a uniquely designed, highly efficient, and reliable thermal heat sink intended for a variety of industrial and commercial applications. Its advanced fin array design and highstatic pressure fan make it ideal for dissipating heat quickly and effectively. Its ease of installation and durable construction make it a convenient choice for any device that requires thermal management.
The specific data is subject to PDF, and the above content is for reference