| Allicdata Part #: | ATS-11B-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11B-10-C3-R0 is a component of the thermal - heat sink family. It is a surface-mounted device (SMD), designed primarily for reduction of a board\'s thermal electrical resistance, and is used in the cooling of boards in high-power applications. It is made from a combination of metal and ceramic material, and consists of two main elements: the sink plate, which is the part which comes into contact with the board, and a metal thermal wall, which is used to dissipate heat away from the board.
The sink plate itself is constructed from a combination of copper and aluminum. This design helps to provide excellent thermal conductivity, ensuring that heat is dissipated quickly away from the board. The plate also features a number of openings, allowing air on each side of the board to be cooled, reducing the overall temperature of the board.
The metal thermal wall has three main functions. Firstly, it acts as a protective barrier, ensuring that any heat generated from the board is not spread any further than necessary. Secondly, it acts as a conductor, transporting the heat from the board to an outside location. Finally, it helps to spread the heat away from the board, reducing the temperature of the board in its entirety. This ensures that the board remains within a temperature that is safe to operate.
The ATS-11B-10-C3-R0 is an effective heat sink, used in a wide range of applications. It is often used in power supplies, in which it helps to keep the power supply running safely, even at high temperatures. It is also used in industrial power supplies, where it helps to reduce the power consumption of the system and keep the temperature within safe limits. In addition, it is used in LED applications, where it helps to ensure that the LED\'s are kept at an appropriate temperature.
The ATS-11B-10-C3-R0 is a high performance heat sink, designed to reduce board thermal resistance. Its combination of metal and ceramic material helps to provide excellent thermal conductivity, allowing it to quickly and efficiently dissipate heat away from the board. Its metal thermal wall ensures that excess heat is not spread any further than necessary, while also helping to spread the heat away from the board and reduce the overall temperature. This makes the ATS-11B-10-C3-R0 an ideal solution for a wide range of high power applications.
The specific data is subject to PDF, and the above content is for reference