| Allicdata Part #: | ATS-11B-135-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-135-C3-R0 |
| Price: | $ 7.30 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-135-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.56964 |
| 30 +: | $ 6.20487 |
| 50 +: | $ 5.83997 |
| 100 +: | $ 5.47495 |
| 250 +: | $ 5.10996 |
| 500 +: | $ 4.74496 |
| 1000 +: | $ 4.65371 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.04°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks play an important role in electronics, as they help dissipate the heat that builds up due to the electrical components in use. The ATS-11B-135-C3-R0 is a thermal heat sink that is used in electronics to help dissipate the heat that builds up from electrical components. This heat sink has a number of features that make it an ideal choice for various applications.
Design of ATS-11B-135-C3-R0
The ATS-11B-135-C3-R0 is a medium-sized heat sink designed for use in smaller electronics applications. It measures in at 135mm x 135mm x 50mm and has a weight of only 210 grams. The heat sink consists of multiple fins that are made from aluminum alloy and have a stepped connection to increase the heat dissipation over a larger surface area. There is also an air inlet located at the base of the heat sink that allows air to enter and exit the heat sink freely.
Application Field of ATS-11B-135-C3-R0
The ATS-11B-135-C3-R
The specific data is subject to PDF, and the above content is for reference