ATS-11B-142-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.07°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal-Heat Sinks are devices that are designed to absorb and dissipate heat from objects being cooled. These devices are used in a variety of applications, from consumer electronics to industrial applications. ATS-11B-142-C2-R0 is a thermal-heat sink that has been designed specifically for use in applications that require high power or extreme temperatures. In this article, we will discuss the application field and working principle of the ATS-11B-142-C2-R0.

Application Field

The ATS-11B-142-C2-R0 thermal-heat sink is designed for use in applications that require high power or extreme temperatures. It can be used in electronic devices such as laptop computers, video game systems, and cell phones. It is also designed for use in high-powered automotive and industrial systems, such as engine control, fuel control, and emissions control systems.The ATS-11B-142-C2-R0 is designed to provide reliable thermal management in extreme temperature ranges. This thermal-heat sink offers a dimensional range of 142 x 146 x 30 mm and a weight range of 330 – 550 grams. It has a maximum thermal dissipation of 200 watts and a maximum temperature range of -40°C to 80°C.

Working Principle

The ATS-11B-142-C2-R0 thermal-heat sink works by transferring heat from an object into the surrounding air. The device is composed of two parts: the base and the fins. The base is made from copper or aluminum and is designed to absorb heat from the object being cooled. The fins are made from aluminum or plastic and are designed to dissipate the heat into the surrounding air.The thermal-heat sink works by creating a turbulent flow of air between the fins and the base. This flow of air carries heat away from the object and into the fin surfaces. The fins then dissipates the heat to the air. This process of transferring the heat is known as convection.The ATS-11B-142-C2-R0 thermal-heat sink is designed with a large surface area and thin fins, which helps to maximize the amount of heat that is dissipated into the surrounding air. The device also features a number of mounting holes, which makes installation easier.

Conclusion

The ATS-11B-142-C2-R0 thermal-heat sink is a reliable and efficient device that is designed for use in applications that require high power or extreme temperatures. It is designed with a large surface area and thin fins, which helps to maximize the amount of heat that is dissipated. The device also features a number of mounting holes, which makes installation easier. By understanding the application field and working principle of the ATS-11B-142-C2-R0 thermal-heat sink, users can be sure to get the most out of their device.

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