| Allicdata Part #: | ATS-11B-142-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-142-C3-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-142-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11B-142-C3-R0 is a sophisticated thermal management device used in a variety of applications including telecom servers, home systems, and data centers. It is designed to efficiently dissipate heat and maintain optimal temperature levels in order to ensure optimal performance and protection against component damage. The ATS-11B-142-C3-R0 features a unique combination of advanced materials, cutting-edge thermal engineering, and superior thermal management.
The ATS-11B-142-C3-R0 is based on a passive thermal management system, meaning it does not use any active sources of cooling like a fan or liquid coolants. It uses a combination of conduction and convection to transfer heat away from critical components and dissipate the heat into the surrounding air. This passive heat sink is capable of dissipating up to 200W of power.
The ATS-11B-142-C3-R0 is constructed from a highly conductive metal alloy which conducts heat quickly and efficiently away from critical components. It also features a number of internal fins which act as channels for the air to flow through, providing additional cooling. The device also includes a large number of curved fins which optimize the amount of heat transfer due to their increased surface area and symmetrical shape. These fins can be adjusted to suit different applications and also provide an increase in the total heat sink surface area.
The thermal management system is made up of two parts: a heat sink and a cooler. The heat sink is responsible for dissipating the majority of the heat from the system and transferring it to the surrounding air. The cooler is responsible for providing additional cooling if needed. The cooler is installed between the heat sink and the load and is capable of cooling up to 200W of power. The cooler has adjustable fan speeds and is designed to keep the temperature of the system below a certain threshold in order to ensure optimal performance.
The ATS-11B-142-C3-R0 is an ideal thermal management solution for applications where high thermal loads and effective cooling are required. It is capable of dissipating large amounts of heat quickly and efficiently while maintaining optimal temperatures. It is the perfect choice for telecom servers, home systems, and data centers.
The specific data is subject to PDF, and the above content is for reference