ATS-11B-163-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.88°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11B-163-C1-R0 - Thermal - Heat Sinks

Thermal - Heat Sinks are devices for dissipating heat from hot-running components, protecting them from overheating or failing. ATS-11B-163-C1-R0 is a low-profile heat sink that utilizes advanced aluminum extrusion technology for superior performance. The chip is designed to provide thermal stability to delicate electronic components, while keeping the maximum operating temperature and power dissipation within safe limits.The ATS-11B-163-C1-R0 Thermal - Heat Sink is made from anodized aluminum for superior performance. Its finned surface increases the area of the heat sink and enables greater cooling performance. It uses a copper layer at the base for better heat transfer, resulting in improved heat dissipation. The heat sink has a unique finned-rib design which enables it to operate with lower noise.The ATS-11B-163-C1-R0 is a versatile, low-profile heat sink designed for electronics protection. Its unique finned rib-structure makes it ideal for high power components, such as CPUs and other heat-generating components. Its thermal control system ensures safe cooling of delicate components, ensuring that they operate within safe operating temperature and power dissipation range.The ATS-11B-163-C1-R0 has a unique finned-rib design for efficient thermal control. It features a copper layer at the base for excellent heat transfer, resulting in improved heat dissipation. The fins also provide an aerodynamic design to reduce noise. The fanless design allows the heat sink to be used in applications where noise reduction is critical.The ATS-11B-163-C1-R0 is an excellent solution for low-profile cooling requirements. Its low-profile design enables it to fit in cramped areas, offering a space-saving solution. Its high-performance, finned-rib structure is also suitable for demanding high power application.The ATS-11B-163-C1-R0 is designed for use in data centers, server systems, and other high performance applications. It is a reliable, high performance heat sink designed to provide thermal stability and maximum cooling performance. The heat sink is tested and certified to meet the strictest of industry standards, making it an ideal choice for mission-critical applications.In summary, the ATS-11B-163-C1-R0 Thermal - Heat Sink is an excellent solution for cooling hot-running electronics components. It is a low-profile solution that utilizes an aerodynamic design to reduce noise, and provides excellent cooling performance. It is suitable for a range of applications, and is tested and certified to meet the strictest of industry standards.

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