ATS-11B-170-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.181" (30.00mm)
Width:	1.181" (30.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.590" (15.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	10.26°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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What is ATS-11B-170-C3-R0 Thermal - Heat Sinks?

The ATS-11B-170-C3-R0 Thermal - Heat Sinks is an electronic device that is used in a variety of applications. This device is composed of two metal plates typically made of copper or aluminum that are connected together by a thermal interface material. These heat sinks are designed to conduct heat away from components in order to prevent them from becoming too hot. This product is available in a variety of sizes and shapes, and is typically used in electronic devices such as computers, cell phones, and other heat-producing components.

Applications of ATS-11B-170-C3-R0 Thermal - Heat Sinks

The ATS-11B-170-C3-R0 Thermal - Heat Sinks are used in a variety of applications, and can be found in nearly any electronic device. The most common applications are found in desktop and laptop computers, but this product can also be found in cellular phones, game systems, navigation systems, television sets, audio equipment, and other electronic components that produce heat. Heat sinks are vital to keeping electronic components functioning properly; without them, components can easily overheat and malfunction.

Working Principle of ATS-11B-170-C3-R0 Thermal - Heat Sinks

The working principle of ATS-11B-170-C3-R0 Thermal - Heat Sinks is relatively simple. Heat is generated by the electronic components within the device. This heat is conducted away from the components, and is absorbed by the heat sink. As the heat sink heats up, it begins to expand. This expansion causes the heat to be transferred from the heat sink to the air surrounding it, thus keeping the components within the device from overheating. The ATS-11B-170-C3-R0 Heat Sink is designed with a metal surface which increases the heat transfer rate. This metal surface is also designed to have a low thermal resistance which allows for maximum heat transfer away from the component. As the heat is transferred away from the component, the temperature of the component begins to decrease and the heat sink itself is cooled.

Heat Sink Sizing Guide

While the ATS-11B-170-C3-R0 Heat Sink is available in a variety of sizes, it is important to choose a size that is suitable for your device. Usually, the size of the heat sink is determined by the amount of heat generated by the component and the space constraints of the device. It is important to make sure that the heat sink will be able to fit within the device without causing any clearance or installation issues. In addition, it is important to make sure that the heat sink is able to efficiently transfer the heat away from the component. The size of the heat sink should correspond to the size of the component so that there is enough area to handle the heat produced by the component. If the fit of the heat sink is incorrect, the device may overheat and malfunction.

Maintenance of ATS-11B-170-C3-R0 Thermal - Heat Sinks

While ATS-11B-170-C3-R0 Heat Sinks are designed to provide reliable and efficient thermal management, they require some maintenance in order to ensure that they are working properly. It is important to regularly check the heat sink for any signs of damage. The heat sink should be free of any debris or buildup that could reduce its efficiency. Additionally, the heat sink should be kept clean and free of dust and other air particles.Finally, it is important to make sure that the thermal interface material used to connect the heat sink to the component is in good condition. The thermal interface material should be checked periodically to make sure that it has not become stiff or brittle, as this could reduce the effectiveness of the heat sink.

Conclusion

The ATS-11B-170-C3-R0 Thermal - Heat Sinks is an essential component in any device that produces heat. This product is designed to efficiently transfer heat away from the component, keeping it from becoming too hot and malfunctioning. This product is available in a variety of sizes and shapes, and should be chosen and maintained carefully in order to ensure that it is properly working.

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