| Allicdata Part #: | ATS-11B-184-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-184-C3-R0 |
| Price: | $ 4.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-184-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.81717 |
| 30 +: | $ 3.60507 |
| 50 +: | $ 3.39293 |
| 100 +: | $ 3.18087 |
| 250 +: | $ 2.96881 |
| 500 +: | $ 2.75675 |
| 1000 +: | $ 2.70374 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an essential component of the production process. Designing a solution to address the needs of a particular application is no easy task. Fortunately, products such as ATS-11B-184-C3-R0 offer an excellent solution to the thermal demands of many applications. This thermal solution is a reliable and efficient heat sink that is perfect for dissipating heat from electronic components and other related applications.
The ATS-11B-184-C3-R0 is a standard heat sink that can be used in a variety of applications such as automotive, medical, consumer electronics, industrial and safety applications. It features a metal base plate, fins and a built-in thermal resistant pad for mounting. The heat sink is designed to provide thermal management for components that generate high amounts of heat such as power control units, digital video recorders, processors and motor drivers.
The working principle of the ATS-11B-184-C3-R0 is based on the natural cooling process of a heat sink. When the heat sink is exposed to air, a natural convection process begins to take place. Heat builds up in the fins of the heat sink and is then dissipated to the air around it. This helps to keep the components cool and prevent overheating.
The ATS-11B-184-C3-R0 is also highly efficient in dissipating heat. The fins are designed to maximize the surface area for heat transfer and improve the thermal conductivity. The metal base plate provides a low thermal resistance which helps to reduce the temperature rise of the components. Additionally, the built-in thermal pad helps to absorb and dissipate heat away from the components even further.
The ATS-11B-184-C3-R0 is an excellent choice for applications that require thermal management solutions. It provides efficient heat transfer and dissipation, low thermal resistance, and is easy to mount with its built-in thermal pad. This thermal solution can help ensure that components remain cool and continue to perform optimally.
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