| Allicdata Part #: | ATS-11B-19-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-19-C3-R0 |
| Price: | $ 4.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X20MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-19-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.03704 |
| 30 +: | $ 3.81255 |
| 50 +: | $ 3.58823 |
| 100 +: | $ 3.36401 |
| 250 +: | $ 3.13974 |
| 500 +: | $ 2.91548 |
| 1000 +: | $ 2.85942 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions provide a controlled environment and help to regulate temperatures, humidity and air flow throughout an application. One such product which can be used to ensure efficient thermal management is the ATS-11B-19-C3-R0 heat sink. This article outlines the application fields of the ATS-11B-19-C3-R0 heat sink as well as the working principle of the technology.
The ATS-11B-19-C3-R0 heat sink is primarily designed for cooling electronics, optical systems and semiconductors that are in high operating temperatures. Its high thermal capacity, low thermal resistance, and lightweight components make it perfect for use in many different applications. One of the biggest advantages of the ATS-11B-19-C3-R0 heat sink is its ability to quickly adjust to external temperatures, making it ideal for applications that require rapid heat dissipation.
The ATS-11B-19-C3-R0 heat sink has a unique design that enables it to achieve high thermal performance. Its low thermal resistance helps it to dissipate heat quickly and efficiently as well as reduce the overall heat load of the device being cooled. This means that the device is able to operate at lower temperatures and minimize energy consumption, making it an ideal thermal management solution.
One of the primary benefits of the ATS-11B-19-C3-R0 heat sink is its ability to dissipate heat without the need for a fan. Its low thermal resistance is enabled by the use of multiple fins that increase the heat dissipation area, allowing the product to maintain high performance without the need for a fan. This fan-less design helps to reduce energy consumption and reduce the overall size of the device, making it perfect for use in confined areas.
The ATS-11B-19-C3-R0 heat sink also features a patented finned copper pattern. This finned copper pattern helps to increase heat transfer, while allowing air to flow freely around the heat sink fins. The finned copper pattern also helps to guide air away from the heat sink, ensuring that the heat is evenly spread across the entire surface area.
The ATS-11B-19-C3-R0 heat sink is an efficient and economical choice for cooling temperature sensitive electronic components. Its high thermal capacity, low thermal resistance and lightweight components make it suitable for a range of applications, allowing it to provide reliable cooling performance. Its patented finned copper pattern ensures an even heat exchange and rapid heat dispersal, while the fan-less design ensures maximum energy efficiency and a significantly reduced size.
The specific data is subject to PDF, and the above content is for reference