ATS-11B-194-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11B-194-C1-R0-ND

Manufacturer Part#:

ATS-11B-194-C1-R0

Price: $ 3.07
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11B-194-C1-R0 datasheetATS-11B-194-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.75814
30 +: $ 2.68359
50 +: $ 2.53436
100 +: $ 2.38531
250 +: $ 2.23625
500 +: $ 2.16171
1000 +: $ 1.93808
Stock 1000Can Ship Immediately
$ 3.07
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.02°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com


Thermal management is of critical importance in today\'s ever-increasing technological advances. Electronics of all types generate a tremendous amount of heat, and often need to be cooled in order to function properly. Heat sinks, such as the ATS-11B-194-C1-R0, are one of the most efficient methods of cooling these electronics. In this article, we will explore the ATS-11B-194-C1-R0\'s application field and working principle.

The ATS-11B-194-C1-R0 is a compact, yet highly effective, aluminum heat sink. Its 100 x 95 x 20.5 mm size makes it ideal for use in a variety of applications, from small consumer electronic devices to large industrial systems. One of the main benefits of the ATS-11B-194-C1-R0 is its thermal conductivity, which is 8.2 W/mK. This means it is able to efficiently dissipate the heat created by electronics and ensure long-term reliability.

The ATS-11B-194-C1-R0 is designed with a range of unique features. Its side-by-side fins provide exceptional fin-to-base contact and allow for efficient heat transfer. Additionally, its copper base has a low thermal resistance, allowing for rapid heat transfer and increased efficiency.

The heat sink is also equipped with a modular mounting system that is designed to reduce installation time and effort. The system allows for up to three heat sinks to be stacked together and mounted with only two screws, which makes the installation process easier and faster.

The ATS-11B-194-C1-R0\'s working principle is relatively simple. Heat is created when electrical currents pass through circuit boards and components within electronic devices. The ATS-11B-194-C1-R0 is designed to absorb this heat and quickly dissipate it into the environment. The aluminum and copper components of the heat sink act as a heat conduit, transferring the heat away from the components and allowing it to be dissipated into the air.

In addition to dissipating heat, the ATS-11B-194-C1-R0 can also help protect sensitive electronic components from damage caused by excessive heat buildup. By effectively removing the heat from the components and transferring it into the environment, the risk of overheating is minimized and the life of the components is extended.

The ATS-11B-194-C1-R0 is an ideal solution for cooling devices in a variety of fields, including consumer electronics, industrial automation, computing, and automotive. Its combination of features and benefits make it an ideal choice for any application that requires reliable and efficient cooling.

The ATS-11B-194-C1-R0 is an example of modern thermal design and construction excellence. Its construction offers exceptionally efficient and reliable heat transfer, and its compact size allows for quick and easy installation. With its range of features and benefits, the ATS-11B-194-C1-R0 is the perfect solution for those who require efficient cooling solutions in their electronics systems.

The specific data is subject to PDF, and the above content is for reference

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