ATS-11B-20-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11B-20-C3-R0 Thermal - Heat Sinks

Heat sinks are an essential component in modern electronic equipment and devices. Without them, microprocessors, amplifiers, LED lights and other components would quickly overheat. Heat sinks are designed to absorb and dissipate heat away from these vital components. The ATS-11B-20-C3-R0 is one such heat sink that is specifically designed to keep devices cool in stressful conditions and in small spaces.The ATS-11B-20-C3-R0 is a thermal - heat sink that consists of several thin metal plates connected by a complex copper bonding and aluminum stretching process. This creates many small fins, which are considered the heat dissipation points. The surface of each heat dissipation point is individually machined to ensure maximum heat dissipation. This heat sink has a special coating which helps to further enhance the heat dissipation efficiency of the entire system.The ATS-11B-20-C3-R0 has a thermal resistance of 0.2°C/W and a thermal impedance of 0.4°C/W. The heat sink is suitable for working at a maximum ambient temperature of 50°C. This means that the heatsink can be used in highly demanding applications where heat dissipation is essential for efficient operation.The heat sink has two main types of applications. Firstly, it can be used for cooling microprocessors, amplifiers, LEDs, and optoelectronic devices. This is because it increases the heat transfer and dissipation capacity of these devices. Secondly, the ATS-11B-20-C3-R0 can also be used for cooling small and compact electronic components. This is due to the low profile of the heat sink, which allows it to be fitted in tight spaces.The heat sink works by taking heat away from the device or device part it is attached to. This is done through direct contact between the heat sink and the surface of the device part or component. The heat is then dissipated away from the device through metal fins, where it is absorbed by the surrounding air. This is why the ATS-11B-20-C3-R0 is considered to be an effective solution for cooling small and sensitive parts.The ATS-11B-20-C3-R0 is also a very reliable and durable heat sink. This is because it is made of high-quality aluminum and copper materials. In addition, the heat sink has an anodized finish which helps to protect it from corrosion. This ensures that the heat sink will last for a long time and can be used in a variety of different settings.The ATS-11B-20-C3-R0 heat sink is a cost-effective solution for cooling small and sensitive electronic components. It is reliable, durable, and provides an efficient way of dissipating heat away from the device. It can also be used for cooling larger devices such as amplifiers, LEDs, and optoelectronic devices. This makes the ATS-11B-20-C3-R0 a reliable and effective solution for a wide range of electronic problems.

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