| Allicdata Part #: | ATS-11B-205-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-205-C1-R0 |
| Price: | $ 3.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 60X60X6MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-205-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.34026 |
| 30 +: | $ 3.25017 |
| 50 +: | $ 3.06974 |
| 100 +: | $ 2.88912 |
| 250 +: | $ 2.70857 |
| 500 +: | $ 2.61828 |
| 1000 +: | $ 2.34741 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.362" (60.00mm) |
| Width: | 2.362" (60.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.236" (6.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.98°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat sinks play a significant role in the field of electronic applications. Heat sinks are mainly used to reduce the temperature of components which are maintained at high temperatures due to the operation of the electronic device. ATS-11B-205-C1-R0 is one such heat sink which is widely used in many electronic applications.
The ATS-11B-205-C1-R0 Heat sink is made of Aluminum Alloy and offers an excellent thermal performance with its large heat dissipating area. The heat sink is designed with fins which helps in the efficient heat exchange between the device and the environment. Its low profile design and simple installation make it a preferred choice of many applications. The ATS-11B-205-C1-R0 heat sink is designed to endure large temperature range and also offers a long life.
The ATS-11B-205-C1-R0 heat sink works on a simple principle. The device is placed on the top of the heat sink. This heat from the device dissipates to the environment via the heat sink. The fins in the heat sink allow air to flow and increase the rate of heat transfer. The heat is then dissipated to the environment. This helps in keeping the device at a safe operating temperature.
The ATS-11B-205-C1-R0 heat sink can be used in applications such as consumer electronics, power supplies, industrial and automotive applications. It is also used in many general and precision electronic equipment. Due to its excellent heat dissipation capabilities, the heat sink is used in various other applications which require efficient heat dissipation and comfortable working environments.
The ATS-11B-205-C1-R0 heat sink has many features which make it an ideal choice for many applications. The large heat sink area helps in effective heat transfer to the surroundings. The low profile design and simple installation make it suitable for tight spaces. It is also designed to handle large temperature range and provides long life.
In conclusion, the ATS-11B-205-C1-R0 heat sink is an ideal solution to many electronic applications which require efficient heat dissipation and long life. The heat sink offers an excellent thermal performance and is capable of handling large temperature range. Its large heat dissipating area helps in providing effective heat exchange to the surroundings. The low profile design, simple installation and long life make it a popular choice in many applications.
The specific data is subject to PDF, and the above content is for reference