| Allicdata Part #: | ATS-11B-31-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-31-C1-R0 |
| Price: | $ 5.09 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X5.84MM |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-31-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.58073 |
| 30 +: | $ 4.32600 |
| 50 +: | $ 4.07156 |
| 100 +: | $ 3.81704 |
| 250 +: | $ 3.56257 |
| 500 +: | $ 3.30810 |
| 1000 +: | $ 3.24449 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 25.23°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal technology is an increasingly popular way to reduce the overall temperature of electrical and electronic components. Heat sinks are one of the most important components of thermal management systems. The ATS-11B-31-C1-R0 is a high-performance heat sink designed for cooling a broad range of industry-standard electronic components. This heat sink is comprised of a base, fins, and optional thermal interface material.
The base of the ATS-11B-31-C1-R0 is manufactured from high-grade aluminum, which provides superior thermal conductivity and excellent strength to weight ratio. Furthermore, it is equipped with as many as 4 through-holes, which allow for easy mounting of the heat sink to most standard electrical components. Additionally, the base design features a unique fin geometry, which increases the surface area available for heat dissipation.
The unique fin geometry of the ATS-11B-31-C1-R0 also helps to improve the effectiveness of the heat sink. The fins are designed to create an increased resistance to air convection, which helps to ensure that the heat is efficiently dissipated and spread evenly throughout the component. Furthermore, the air velocity of the fins are adjustable, which helps to further increase the cooling performance of the heat sink.
The ATS-11B-31-C1-R0 also features an optional thermal interface material. This thermal interface material is designed to reduce the thermal resistance between the heat sink and the component being cooled. Typically, the thermal interface material is a combination of thermally conductive grease and resilient foam, which helps to ensure that the heat generated by the component is effectively dissipated.
Finally, the ATS-11B-31-C1-R0 is designed to be extremely reliable and efficient. The heat sink is rated to operate up to a maximum of 250°F (121°C); this makes the ATS-11B-31-C1-R0 ideal for use in harsh environments. Additionally, the heat sink is able to dissipate up to 4 watts of energy. This makes the ATS-11B-31-C1-R0 an excellent choice for electrical and electronic components that are exposed to high levels of heat.
In conclusion, the ATS-11B-31-C1-R0 is a high-performance heat sink designed for cooling a broad range of industry-standard electronic components. It is designed with a unique fin geometry, which helps to improve the effectiveness of the heat sink and can be equipped with an optional thermal interface material to further reduce the thermal resistance between the heat sink and the component being cooled. With its high-grade aluminum base and adjustable fins, the ATS-11B-31-C1-R0 is a reliable and efficient thermal management solution for applications in harsh environments, making it an ideal choice for anyone looking for a dependable heat sink.
The specific data is subject to PDF, and the above content is for reference