ATS-11B-33-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	1.450" (36.83mm)
Diameter:	--
Height Off Base (Height of Fin):	0.700" (17.78mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	17.40°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

The ATS-11B-33-C1-R0 (ATS) is a thermal heat sink designed for applications in extreme environments. It is made up of a base plate, a heat spreader and a connection plate. This thermal heat sink is constructed with a number of fins, and the fin array can be customized for specific applications. The ATS is designed to dissipate heat away from critical components in extremely high ambient temperatures, such as high-power LEDs, power electronics, and motor control systems. It is also suitable for industrial settings, military applications and safety applications.

Design and Features

The ATS thermal heat sink has a number of design features that set it apart from the competition. The baseplate is made from aluminum or copper, while the heat spreader is made from a variety of materials, such as copper, brass, steel and aluminum. The connection plate is designed to allow for easy installation and adjustment of the thermal heat sink. It has an array of fins that are designed to maximize heat dissipation. The fins are also designed to reduce the risk of damage during installation.The ATS also has a range of customization options available. The fin array can be materialized in a variety of heights and shapes to suit specific thermal requirements. The surface finish of the heat spreader can also be customized to provide additional thermal characteristics. This customization allows the thermal heat sink to be tailored to meet the specific needs of the application.

Application Fields

The ATS thermal heat sink is suitable for a wide range of applications, including: 1. High-power LEDs – The ATS thermal heat sink is ideal for high-power LED applications, providing excellent heat dissipation and preventing the LED from overheating.2. Power electronics – The ATS thermal heat sink provides superior thermal performance for power electronics applications, such as power supplies and inverters. 3. Motor control systems – The ATS thermal heat sink is designed to dissipate heat away from critical components in motor control systems. This prevents the system from overheating and improves reliability.4. Industrial applications – The ATS thermal heat sink is suitable for use in a wide range of industrial applications, including process control and safety systems.

Working Principle

The ATS thermal heat sink works by dissipating heat away from critical components. The fins in the heatsink absorb the heat and transfer it away from the component. The fins act as an air-to-air radiator, dissipating the heat away from the component and into the surrounding environment. The fins also act as a convective cooling system, which is more efficient than air-cooling alone. The heat spreader in the ATS thermal heat sink is designed to maximize heat dissipation. The surface finish of the heat spreader determines how efficiently it dissipates heat. The fins in the array also play an important role in dissipating heat, and their height and shape can be customized to meet application specific requirements.

Conclusion

The ATS thermal heat sink is an ideal solution for applications in extreme environments. It is designed to dissipate heat away from critical components, such as high-power LEDs, power electronics, and motor control systems. The ATS thermal heat sink is constructed with a baseplate, heat spreader and connection plate, and the fin array can be customized for specific applications. The range of customization options makes the ATS thermal heat sink suitable for a wide range of applications.

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