| Allicdata Part #: | ATS-11B-35-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-35-C3-R0 |
| Price: | $ 5.53 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X5.84MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-35-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.97385 |
| 30 +: | $ 4.69749 |
| 50 +: | $ 4.42109 |
| 100 +: | $ 4.14477 |
| 250 +: | $ 3.86845 |
| 500 +: | $ 3.59213 |
| 1000 +: | $ 3.52306 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.230" (5.84mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 22.55°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks, specifically ATS-11B-35-C3-R0, are devices designed to move heat quickly away from an electronic component, typically a computer processor. Heat generated by the component can shape the component’s performance, and in the worst-case scenario, it can lead to catastrophic failure. Heat sinks can dissipate this heat more safely and give the electronic component a much longer lifespan.
This particular type of heat sink, the ATS-11B-35-C3-R0, is a thermal-based heat sink. This type of heat sink uses thermodynamics to carry heat away. It relies on the natural circulation of air around it to transfer the heat away from the component and into the surrounding environment. These thermal heat sinks are specifically designed for computer processors.
The ATS-11B-35-C3-R0 is designed to dissipate the heat from computer processors in a reliable and efficient manner. It is constructed using a series of aluminum fins which are arranged in a circular pattern. The fins are spaced apart to allow air to flow freely around them, transferring the heat away from the processor to the surrounding environment.
The ATS-11B-35-C3-R0 is also fitted with a fan that sits in the center of the circle of fins. The fan helps to circulate the air even further, dissipating the heat more quickly. The fan also pulls in cooler air from outside the heat sink, further promoting efficient and reliable heat dissipation.
These thermal heat sinks take advantage of the properties of thermodynamics to quickly and effectively dissipate heat away from the processor, keeping it running cool and efficiently for longer. This reduces the risk of overheating and damage to the electronic component.
The ATS-11B-35-C3-R0 is created from high-grade aluminum and is built to last. The heat transfer fins are tightly spaced, allowing more air to flow through them and increasing their efficiency. The fan is also designed to run quietly, minimizing any distractions in the workplace.
The ATS-11B-35-C3-R0 is an effective and reliable way to reduce the risk of damage to electronic components caused by overheating. The thermal heat sink takes advantage of thermodynamics and circulation of air to dissipate heat away from vulnerable components, while also remaining quiet and efficient. In doing so, the ATS-11B-35-C3-R0 is an excellent choice for dissipating the heat from computer processors, ensuring longer lifespans for these valuable components.
The specific data is subject to PDF, and the above content is for reference