| Allicdata Part #: | ATS-11B-36-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-36-C3-R0 |
| Price: | $ 5.68 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 36.83X57.6X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-36-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.11245 |
| 30 +: | $ 4.82853 |
| 50 +: | $ 4.54444 |
| 100 +: | $ 4.26044 |
| 250 +: | $ 3.97641 |
| 500 +: | $ 3.69238 |
| 1000 +: | $ 3.62137 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 1.450" (36.83mm) |
| Width: | 2.267" (57.60mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.90°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are an integral part of many devices in a variety of applications. The ATS-11B-36-C3-R0 thermal heat sink is a high performance product that is designed to dissipate large amounts of heat from critical components, such as transistors, IC chips and other components commonly found in electronic devices. The ATS-11B-36-C3-R0 heat sink is designed to provide an efficient and reliable means of cooling components while keeping equipment and assets safe.
The ATS-11B-36-C3-R0 thermal heat sink is a high-efficiency solution for dissipating heat in a wide range of devices such as microcontrollers, telecom equipment, and battery packs. This heat sink has a large contact area with a flat profile design for optimal heat transfer. The design also features multiple fins spaced apart, which allows for a higher air flow rate and Better thermal performance. The fins are also designed to reduce the amount of heat that escapes, thereby providing significant temperature reductions.
The ATS-11B-36-C3-R0 thermal heat sink utilizes a clip-on design, which allows for easy installation. The clips attach directly onto the component, creating a strong and secure connection that helps to ensure the unit will stay in place during operation. This type of system also provides a uniformly distributed force when pressure is applied to the clip connection, allowing for even air flow throughout the device.
The ATS-11B-36-C3-R0 thermal heat sink utilizes a passive cooling method that does not use any external power source or energy consumption. This method relies on the natural convective heat transfer between the fins on the unit and the air. As the air flows over the fins, heat is dissipated from the components. This method requires no additional fans or other energy-consuming accessories, making it very efficient and cost-effective.
The ATS-11B-36-C3-R0 thermal heat sink is also very reliable and can handle large amounts of heat production. The unit is constructed of aluminum for greater durability and strength, and it is designed to withstand a wide range of temperatures. Due to the large contact area and increased air flow, this type of heat sink is capable of dissipating heat faster and with greater efficiency than other solutions.
The ATS-11B-36-C3-R0 thermal heat sink is an excellent choice for a wide range of applications where efficient and reliable cooling is required. The unit is easy to install and provides substantial temperature reduction, making it an ideal solution for many electronic devices. With its clip-on design and passive cooling method, the ATS-11B-36-C3-R0 thermal heat sink is an efficient and reliable solution for dissipating heat in electronic devices.
The specific data is subject to PDF, and the above content is for reference