| Allicdata Part #: | ATS-11B-45-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-45-C1-R0 |
| Price: | $ 3.21 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-45-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.92446 |
| 30 +: | $ 2.84550 |
| 50 +: | $ 2.68733 |
| 100 +: | $ 2.52926 |
| 250 +: | $ 2.37119 |
| 500 +: | $ 2.29216 |
| 1000 +: | $ 2.05503 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 14.95°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are devices that are specifically developed to combat increasing temperatures in electronic components in order to keep them from overheating or burning out. They have been traditionally made from aluminum or copper, however more recently thermal conductors such as graphite are being used. The ATS-11B-45-C1-R0 is a heat sink specifically designed for applications in the semiconductor industry. It has a maximum temperature rating of up to 125°C and is composed of an aluminum base with aluminum fins. It includes a built-in fan to maximize the cooling of the entire package.
The ATS-11B-45-C1-R0 was designed to dissipate heat from high-power components that may reach temperatures of up to 125°C. This heat sink is ideal for applications such as RF power amplifiers, high-power laser diodes, as well as other high-power semiconductor devices. It includes a built-in fan in order to ensure that the maximum heat is dissipated during operation as well as providing maximum cooling for the entire device.
The ATS-11B-45-C1-R0 is composed of an aluminum base with fins that are composed of extruded aluminum. This ensures maximum thermal conductivity since aluminum is a thermal conductor. The fins are evenly spaced which allows for maximum air to circulate around the device and ensure it remains cool during operation. The built-in fan uses a PWM signal to adjust the fan speed according to the internal temperature of the device, allowing for maximum cooling. It also helps to reduce the acoustic noise generated while the device is in operation.
The ATS-11B-45-C1-R0 is an ideal solution for cooling high-power semiconductor components due to its ability to reduce temperatures, improve reliability, and reduce the amount of noise generated. It has a wide range of applications including RF power amplifiers, high-power lasers, and other high-power semiconductor devices. The aluminum construction and built-in fan provide maximum cooling and thermal conductivity, as well as reducing acoustic noise during operation.
The working principle of the ATS-11B-45-C1-R0 is quite simple. The device is constructed using aluminum and an aluminum fin base. As the temperature of the electronic components increase, the heat is transferred to the fins which act as heat sinks. The built-in fan then distributes the heat from the fins in order to cool the device. This process reduces the amount of heat generated by the device, thereby reducing the chances of it sustaining damage from overheating.
In conclusion, the ATS-11B-45-C1-R0 is a unique heat sink specifically designed for the semiconductor industry. It has a maximum temperature rating of up to 125°C which enables it to effectively dissipate heat from high-power components. It is composed of an aluminum base and fins which provide maximum thermal conductivity and its built-in fan helps to reduce acoustic noise as well as ensuring maximum cooling. The ATS-11B-45-C1-R0 is an ideal thermal solution for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference