
Allicdata Part #: | ATS-11B-46-C3-R0-ND |
Manufacturer Part#: |
ATS-11B-46-C3-R0 |
Price: | $ 3.51 |
Product Category: | Fans, Thermal Management |
Manufacturer: | Advanced Thermal Solutions Inc. |
Short Description: | HEATSINK 25X25X25MM L-TAB T412 |
More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
DataSheet: | ![]() |
Quantity: | 1000 |
10 +: | $ 3.18591 |
30 +: | $ 3.09981 |
50 +: | $ 2.92774 |
100 +: | $ 2.75549 |
250 +: | $ 2.58325 |
500 +: | $ 2.49714 |
1000 +: | $ 2.23882 |
Series: | pushPIN™ |
Part Status: | Active |
Type: | Top Mount |
Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method: | Push Pin |
Shape: | Square, Fins |
Length: | 0.984" (25.00mm) |
Width: | 0.984" (25.00mm) |
Diameter: | -- |
Height Off Base (Height of Fin): | 0.984" (25.00mm) |
Power Dissipation @ Temperature Rise: | -- |
Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
Thermal Resistance @ Natural: | -- |
Material: | Aluminum |
Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Heat sinks are devices used to cool electronic components and systems. ATS-11B-46-C3-R0 heat sink is a controllable heat sink, designed for cooling electronic components. When mounted on a PCB it provides efficient cooling while allowing temperature control and improved design performance. This is achieved in part by using a number of strategically placed fins and an extra layer of heat-conducting material.
The ATS-11B-46-C3-R0 heat sink is primarily used in very high power components and systems, such as those found in power supplies, servers, and high output audio/video systems. It is also suitable for other applications such as medical and industrial devices.
In order to understand the working principle of the ATS-11B-46-C3-R0 heat sink, it is important to look at the components that make it up. The core of the heat sink is composed of a thick aluminum plate which has been extruded in order to provide maximum heat transfer by increasing surface area. This plate is then clamped into a rigid support frame, where the fins are precisely positioned to maximize airflow.
The fins act as channels for the flow of air and help to dissipate heat away from the core. An additional sheet of heat conducting material, such as copper, is then bonded to the core for more effective thermal transfer. There may also be a thin layer of electroless nickel-plated copper or other material for protection or corrosion resistance.
The ATS-11B-46-C3-R0 heat sink uses a unique design for controlling airflow. An air-flow control damper is situated at the base of the heat sink and is controlled by an Allen-key screwdriver. The damper forces the air to travel over the fins in a direct path giving the heat sink greater cooling power and also reducing noise.
The ATS-11B-46-C3-R0 heat sink also comes with a thermistor sensor which can provide temperature feedback to the control system. This feedback is used to adjust the damper and thus control the airflow, allowing the temperature of the device to be maintained at an optimal level. This allows for more precise and efficient cooling of the device.
In conclusion, the ATS-11B-46-C3-R0 heat sink is an ideal solution for applications that require efficient cooling and precise temperature control. It has a robust and reliable design, which allows for optimal performance in a wide range of electrical devices. The additional features, such as an air-flow control damper and thermistor sensor, provide an efficient solution to heat dissipation and temperature control.
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