| Allicdata Part #: | ATS-11B-60-C3-R0-ND |
| Manufacturer Part#: |
ATS-11B-60-C3-R0 |
| Price: | $ 4.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X35MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-60-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.95577 |
| 30 +: | $ 3.73611 |
| 50 +: | $ 3.51628 |
| 100 +: | $ 3.29654 |
| 250 +: | $ 3.07677 |
| 500 +: | $ 2.85700 |
| 1000 +: | $ 2.80206 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.378" (35.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.50°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a very important technology in the modern world, especially in the fields of electronics and manufacturing. One popular way of achieving thermal management is to use heat sinks, and the ATS-11B-60-C3-R0 is one of the top-rated heat sink products on the market.
The ATS-11B-60-C3-R0 is a heatsink designed for the highest possible thermal performance. It is made of solid copper and aluminum and uses convective heat dissipation to remove heat from the device it is attached to. This type of heatsink is especially useful for high-temperature electronic components, such as those used in power electronics. The ATS-11B-60-C3-R0 has a high-efficiency cooling design, with the fins on the heatsink having a large thermal surface area. This increases the heat dissipation rate of the heatsink, allowing for better thermal performance.
As the name of the heatsink implies, the ATS-11B-60-C3-R0 is designed to work in a range of temperatures from -60 degrees Celsius to +60 degrees Celsius. This allows for a wide range of applications, including high-temperature electronics and industrial applications. The heatsink also has a 3mm thickness, which makes installation easy and can fit in a variety of application spaces.
The ATS-11B-60-C3-R0 is a high-performance heatsink, but its primary purpose is to protect electronics from overheating. This is done by providing a steady airflow between the heat source and the cooling fins. The airflow increases the thermal surface area, which improves the performance of the heatsink. This improved performance helps to keep electronics cool, even under harsh conditions.
The ATS-11B-60-C3-R0 can also be used in applications where cooling is not a primary concern. It can be used as a general-purpose heatsink, as long as it is installed correctly. This means that it can be used in a variety of applications, including power supplies, LEDs, and other electronic heat sinks. It is also versatile, making it suitable for applications with tight space constraints.
The ATS-11B-60-C3-R0 is a superior thermal management solution for a wide range of applications. Its efficient cooling design, wide temperature range, and simple installation make it ideal for any application with high thermal demands. With its superior performance, the ATS-11B-60-C3-R0 is an invaluable tool for any engineer looking to optimize their component’s temperature.
The specific data is subject to PDF, and the above content is for reference