| Allicdata Part #: | ATS-11B-61-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-61-C1-R0 |
| Price: | $ 3.31 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-61-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.00762 |
| 30 +: | $ 2.92635 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.94°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are one of the most valuable components in the electronics industry. By transferring the heat away from the component or device, they keep things running cool and efficient. The ATS-11B-61-C1-R0 thermal-heat sinks are designed to effectively cool various types of components and devices.
The ATS-11B-61-C1-R0 heat sink is made of aluminum extrusion and designed for use in enclosures and cabinets. It has a low profile, small size and light weight which makes it ideal for use in tight spaces. The heat sinks feature an integrated fan cooling system with low noise levels, making them ideal for applications with noise considerations.
The main feature of the ATS-11B-61-C1-R0 heat sink is that it has a large surface area and a very high rate of heat transfer. This is achieved by having an extremely thin layer of aluminum around the components. This layer is designed to absorb and dissipate heat very quickly. In addition, the heat sinks also have a built-in fan that helps to dissipate heat away from the components at a much faster rate. The heat sinks also come with a variety of mounting options, including using adhesive tape for easier installation.
The ATS-11B-61-C1-R0 heat sink is typically used in computer systems, electronic equipment and other related applications such as medical and military systems. It is also often used in automotive and aerospace applications. The heat sink is designed to provide effective cooling for any components or devices that require it.
The main principle behind the ATS-11B-61-C1-R0 thermal-heat sink is that it works by drawing heat away from the component or device and transferring it to the atmosphere. This is done by using a combination of heat-dissipating material, air flow, and fan cooling. The heat from the component or device is transferred to the fins or heat pipes of the heat sink and then dissipated into the air. The fan cooling helps to dissipate this heat away from the component or device, while the material also helps to conduct the heat away from the component.
The ATS-11B-61-C1-R0 thermal-heat sink is a great tool for keeping components and devices running cool and efficient. Its light weight, small size, and low profile make it a great choice for applications where space is limited. In addition, its high rate of heat transfer and low noise levels make it an ideal choice for applications where noise is a concern. With its easy installation and strong performance, it is sure to be a valuable asset in many different types of applications.
The specific data is subject to PDF, and the above content is for reference