| Allicdata Part #: | ATS-11B-63-C1-R0-ND |
| Manufacturer Part#: |
ATS-11B-63-C1-R0 |
| Price: | $ 3.72 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11B-63-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.37617 |
| 30 +: | $ 3.28503 |
| 50 +: | $ 3.10250 |
| 100 +: | $ 2.91999 |
| 250 +: | $ 2.73748 |
| 500 +: | $ 2.64622 |
| 1000 +: | $ 2.37248 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.29°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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"Thermal-Heat Sinks" are used in a variety of applications. One of the most popular applications is in the cooling of electronic components in computers and other electronic devices. The ATS-11B-63-C1-R0 is a type of thermal-heat sink that is commonly used for such applications. This article will discuss the application field and working principle of the ATS-11B-63-C1-R0.
Application Field of ATS-11B-63-C1-R0
The primary application field of the ATS-11B-63-C1-R0 is in the cooling of electronic components. The thermal-heat sink is designed to dissipate heat generated by electronic components and thereby limit their temperature rise. The device also helps to reduce the overall temperature of the surrounding environment, thus improving the reliability and performance of the system.
The ATS-11B-63-C1-R0 is most often used in computer systems and industrial machines that require reliable cooling solutions. It is also used extensively in the telecommunications, automotive, aerospace, and medical industries. Due to its high performance, low price, and durability, the ATS-11B-63-C1-R0 is a popular choice for many applications.
Working Principle of ATS-11B-63-C1-R0
The ATS-11B-63-C1-R0 consists of an aluminum base plate and fins. The base plate absorbs the heat from the electronic components and transfers it to the fins. The fins are designed to provide an increased surface area for heat dissipation and cooling. The increased surface area works to quicken the cooling process, thus improving the overall performance of the system.
In order to ensure optimal performance, the ATS-11B-63-C1-R0 utilizes a patented heat dissipation technology called “Multi-Path Heat Dissipation.” This technology allows the device to evenly dissipate heat across the entire surface of the fins, thus ensuring maximum heat transfer. In addition, the fins are designed to be as thin as possible in order to maximize the amount of surface area exposed to the surrounding air.
In order to improve the overall efficiency of the ATS-11B-63-C1-R0, the device is designed with two interchangeable port modules. The first port module is designed for use with standard 60mm fans, while the second port module is designed for use with larger 120mm fans. The interchangeable port modules allow for greater customization and flexibility in terms of the device\'s cooling capabilities.
Conclusion
The ATS-11B-63-C1-R0 is a thermal-heat sink designed for the cooling of electronic components. Its application fields include computers, industrial machines, telecommunications, automotive, aerospace, and medical industries. The ATS-11B-63-C1-R0 utilizes a patented “Multi-Path Heat Dissipation” technology and two interchangeable port modules in order to ensure optimal performance. The device is designed to provide superior cooling efficiency and exceptional reliability.
The specific data is subject to PDF, and the above content is for reference