ATS-11B-76-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11B-76-C3-R0-ND

Manufacturer Part#:

ATS-11B-76-C3-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 25X25X25MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11B-76-C3-R0 datasheetATS-11B-76-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 0.984" (25.00mm)
Width: 0.984" (25.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.84°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are components that transfer heat away from other components to ensure efficient and safe operation, and the ATS-11B-76-C3-R0 is a thermal heat sink designed to suit a range of applications. In this article, we will discuss the application field and working principle of the ATS-11B-76-C3-R0 thermal heat sink.

Application Field of ATS-11B-76-C3-R0

The ATS-11B-76-C3-R0 is a thermal heat sink that is designed for use in a range of different applications. It is a versatile product that can be employed in low profile, medium profile, and high profile applications. This heat sink is suitable for use in a wide variety of applications, including consumer electronics, power electronics, automotive electronics, medical electronics, telecommunications, and industrial electronics.

The ATS-11B-76-C3-R0 offers high temperature resistance, high thermal conductivity, high pressure resistance, and low contact resistance. It is also capable of resisting corrosion and it is fully compatible with industry standard component footprints. This heat sink is perfect for use in applications that require superior heat transfer and require very little installation space. The ATS-11B-76-C3-R0 also boasts a comprehensive temperature range of -55 degrees Celsius to 150 degrees Celsius.

Working Principle of ATS-11B-76-C3-R0

The ATS-11B-76-C3-R0 utilizes a combination of technologies to ensure efficient and safe heat transfer. At the core of this heat sink is a pin fin array that ensures maximum heat transfer surface area. This pin fin array works by dissipating heat away from the component it is connected to and into the atmosphere. The fins of the ATS-11B-76-C3-R0 are staggered to create additional surface area and improve thermal performance. The pin fin array also helps to reduce electrical impedance, thus ensuring a more efficient transfer of heat.

The ATS-11B-76-C3-R0 is also equipped with a heat spreader. This component is designed to spread heat evenly across the fin array to ensure uniform cooling. The heat spreader also helps to reduce the risk of hot spots on the component, thus reducing the risk of thermal runaway. The spreader gets its thermal performance from its construction, which consists of high thermal conductivity materials such as copper and aluminum. The ATS-11B-76-C3-R0 also features a large base to provide a sturdy mounting platform for the component.

The ATS-11B-76-C3-R0 also features a number of features that make it easy to install and maintain. It is designed to be resistive to corrosion and vibration, and is fully compatible with industry standard mounting systems. The ATS-11B-76-C3-R0 also offers secure and reliable mounting with no additional steps required.

Conclusion

The ATS-11B-76-C3-R0 is a high-performance thermal heat sink with a wide range of applications and offers high temperature resistance, high thermal conductivity, high pressure resistance, and low contact resistance. It also has a pin fin array to maximize heat transfer and reduce electrical impedance, and it is equipped with a heat spreader for improved thermal performance. The ATS-11B-76-C3-R0 offers secure and reliable mounting and is compatible with a range of industry standard mounting systems. With its versatile design, the ATS-11B-76-C3-R0 is a great choice for a wide range of heat transfer and thermal management applications.

The specific data is subject to PDF, and the above content is for reference

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