| Allicdata Part #: | ATS-11C-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management of electronic components is crucial in modern consumer and enterprise applications. Heat sinks are a common method used to transfer heat away from components, including from ATS-11C-10-C1-R0 aluminium heat sinks. ATS-11C-10-C1-R0 aluminium heat sinks are designed for cooling FETs, MOSFETs, IGBTs, and other components with heat transfer properties much higher than that of copper. These aluminium heat sinks provide maximum thermal conductivity along with durability and low cost.
The aluminium used in ATS-11C-10-C1-R0 heat sinks comes in two variants: aluminium (Al) and aluminium- zinc (AZ). Aluminium is lightweight, non-corrosive, and cost-efficient; AZ achieves better heat transfer rates than Al but is also more expensive. The bottom of the heat sink is also machined to give it better dissipation characteristics. These machined fins are stacked on top of each other, providing a greater surface area in contact with the components for maximum heat transfer.
Heat sinks work by exchanging heat with a cooler environment. The heat is transferred away from the components and released into the environment. To further help this process, fans are sometimes used to create airflow across the fins, allowing air to move across their grained surfaces and cool them off. Passive convection techniques are also employed to move air across the heat sink, drawing away the heat.
In terms of application fields, ATS-11C-10-C1-R0 aluminium heat sinks are found in consumer electronics, computing, automotive, and industrial applications. In consumer electronics, the heat sinks are used on consumer video cards, motherboards, gaming consoles, and other hardware. In computing, they are used to cool components within servers, RAID systems, and other data centres. In the automotive sector, they are employed to cool turbochargers, EGR systems, and intercoolers. The industrial sector also utilises them to cool hydraulic and electronic components.
Overall, ATS-11C-10-C1-R0 aluminium heat sinks provide efficient thermal management solutions for electronics. They offer greater thermal dissipation than copper, while remaining cost-efficient and durable. They are employed in a wide variety of applications, from consumer electronics to automotive and industrial applications. By employing active and passive cooling techniques, these heat sinks can greatly reduce temperatures in order to maintain optimal performance.
The specific data is subject to PDF, and the above content is for reference