| Allicdata Part #: | ATS18890-ND |
| Manufacturer Part#: |
ATS-11C-103-C2-R1 |
| Price: | $ 4.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X9.5MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-103-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.34070 |
| 10 +: | $ 4.22163 |
| 25 +: | $ 3.98740 |
| 50 +: | $ 3.75278 |
| 100 +: | $ 3.51823 |
| 250 +: | $ 3.28369 |
| 500 +: | $ 3.04914 |
| 1000 +: | $ 2.99050 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.374" (9.50mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 27.67°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are devices designed to dissipate heat from electronic components, which also result in improved device performance and lifespan. The ATS-11C-103-C2-R1 thermal heat sink is a high-power, high-efficiency, two-piece assembly made from an extruded aluminum heat sink and a funnel shaped thermal base plate for cooler ambient temperature. It is capable of dissipating up to 500 watts of heat output from an electronic component or device without the need for additional fans or cooling towers.
The ATS-11C-103-C2-R1 thermal heat sink is available for use in a wide range of applications and environment conditions. It is suitable for devices such as computers, servers, telecom equipment, data centers, automotive, and industrial electronic systems. It is also used in military, aerospace, and extreme environments where reliable cooling solutions are required.
The ATS-11C-103-C2-R1 works by providing an effective channel for heat to dissipate from the device. The base plate of the heat sink has a funnel shape which accelerates cooling air passing through it, ensuring maximum cooling efficiency. It also has a thermally conductive bonding pad to help transfer heat away from the device. The heat sink also dissipates large amounts of heat quickly, preventing device and component overheating and improving performance.
To ensure maximum efficiency and performance, the ATS-11C-103-C2-R1 is made from high-quality aluminum alloy, which has an efficient heat dissipation rate and is corrosion-resistant. The heat sink is capable of dissipating up to 500 watts, with a maximum temperature of 85°C. The heat sink is also compatible with a variety of cooling fins, providing a variety of configurations for different uses.
The ATS-11C-103-C2-R1 thermal heat sink is easy to install, providing a hassle-free solution for cooling various device applications. It can be used in a wide range of environment conditions and is suitable for small, medium, and large components. It is also a reliable and long-lasting cooling solution, with a maximum lifespan of over 40,000 hours.
The specific data is subject to PDF, and the above content is for reference