| Allicdata Part #: | ATS18898-ND |
| Manufacturer Part#: |
ATS-11C-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is essential for any application, and the ATS-11C-110-C2-R1 is designed to provide the ideal combination of mechanics and heat management. This device is an optimized thermal solution that provides high performance heat transfer between components. It is designed to provide a well-balanced cooling solution for a wide range of applications requiring high performance thermal management.
The ATS-11C-110-C2-R1 is a two-stage thermal solution that consists of two distinct heat sinks. The first stage is a solid aluminum high-performance heat sink that provides a large surface area for maximum heat dissipation. The second stage is an adjustable, finned aluminum heatsink that provides additional cooling for high-power components. The finned design of the second stage heatsink allows for the dissipation of heat from the heated component much faster.
The ATS-11C-110-C2-R1 is ideal for use in a wide range of applications including industrial and commercial electronics and systems. This device is designed to provide superior heat transfer when compared to other thermal solutions due to its optimized heat sink design. It also features optimized mounting capabilities for easy installation in any application. The ATS-11C-110-C2-R1 is also designed to be compatible with a wide range of heating elements and materials, making it easy to adapt to any application.
The ATS-11C-110-C2-R1 is designed to provide superior heat transfer when compared to other thermal solutions. The two-stage design allows for effective cooling, even in high-power applications. The design of the second stage allows for improved air flow, further increasing the heat transfer efficiency. The finned aluminum heatsink absorbs heat from the component and dissipates it throughout the device, while the large surface area of the solid aluminum heatsink allows for maximum heat dissipation.
The ATS-11C-110-C2-R1 is also designed to provide the most flexible thermal management solution for a wide range of applications. It has the capability of being easily adjusted for different environmental conditions, making it a great choice for any application. Additionally, the design of the device provides improved air flow for maximum heat dissipation and efficient cooling.
The ATS-11C-110-C2-R1 is designed to be a comprehensive thermal solution for a wide range of applications. It provides superior heat transfer and cooling capabilities while being easy to install and adjust. This makes it the ideal choice for any application requiring high-performance thermal management.
The specific data is subject to PDF, and the above content is for reference