ATS-11C-140-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.21°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11C-140-C1-R0 Thermal - Heat Sinks

Thermal-Heat Sinks are electronic components used in the thermal management of integrated circuits. They act as a thermal bridge between the hot and cold parts of the circuit board, dissipating heat from the chip to another area, such as the air or a metal heat sink. The ATS-11C-140-C1-R0 is a special application specific thermal-heat sink used in the automotive and industrial markets.The ATS-11C-140-C1-R0 is designed to provide a reliable and efficient heat dissipation solution. It is made of anodized aluminum, which offers superior strength, durability, and corrosion resistance compared to other metals. The device has an array of fins that increase the surface area exposed to air, increasing the amount of heat that can be dissipated from the device. Additionally, the fin design is optimized to ensure even heat distribution for optimal heat transfer.The ATS-11C-140-C1-R0 has a R0 thermal resistance, meaning it can dissipate up to 1°C for each watt of power that it is dissipating. This is higher than many other types of thermal-heat sinks, making it an ideal choice for applications requiring high thermal efficiency. The device also has a C0 coefficient of thermal conductivity, allowing it to conduct heat away from the surface quickly and efficiently. The ATS-11C-140-C1-R0 has a maximum operating temperature of 175°C and an insulation class of 175. It also has a wide operating temperature range, from -55°C to +175°C. It is compatible with both water-based and air-based cooling systems, making it a versatile and reliable solution for many thermal management applications. Additionally, it is designed to meet EMC requirements, making it suitable for a wide range of environments, including military and other high-temperature locations.The ATS-11C-140-C1-R0 can be used in a variety of applications, such as in automotive and industrial controllers, servers, consumer electronics, and medical devices. It can be used to cool integrated circuits in a variety of applications, including surface mount, automotive, and medical electronics. Additionally, it can be used to dissipate heat in various types of contactors, including motor controllers, solenoids, and relays. Overall, the ATS-11C-140-C1-R0 Thermal-Heat Sink is a reliable and efficient solution for managing heat in a variety of applications. Its anodized aluminum construction offers superior strength and corrosion resistance, while its fin design allows for even heat distribution. It also has a wide operating temperature range, making it suitable for a variety of environments. The device is easy to install and has a low thermal resistance, making it an ideal choice for applications requiring high thermal efficiency.

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