| Allicdata Part #: | ATS-11C-163-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-163-C1-R0 |
| Price: | $ 3.86 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X30MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-163-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.50469 |
| 30 +: | $ 3.31002 |
| 50 +: | $ 3.11535 |
| 100 +: | $ 2.92062 |
| 250 +: | $ 2.72591 |
| 500 +: | $ 2.53120 |
| 1000 +: | $ 2.48253 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 2.88°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks is an ideal option when it comes to providing thermal management for electronic components. One of the most common and widely used solutions for this purpose is the ATS-11C-163-C1-R0. This thermal-heat sink is designed to provide a safe, reliable and professional cooling solution for the sensitive components in electronic applications. It utilizes an optimized thermal solution by utilizing unique aluminum fin design to provide uniform heat dissipation.
The ATS-11C- 163-C1-R0 consists of components that have been constructed from a high-quality aluminum alloy. It is a lightweight unit, making it an ideal choice for various types of applications. Its components are interconnected with each other through a series of copper tubes. The entire layout has been designed to provide efficient and reliable cooling.
The aluminum fin design of the ATS-11C-163-C1-R0 is renowned for its efficient thermal management. It utilizes an optimized fin design to ensure that maximum surface area is exposed to air circulation. This ensures that the highest heat dissipation rate is achieved as air circulates through the unit. The fin design also helps to reduce the overall area needed for thermal cooling, reducing the cost of installation. The design also ensures that the component’s material integrity is not compromised.
The ATS-11C-163-C1-R0 is designed to provide efficient thermal management in applications ranging from desktop computers to industrial automation systems. It is an ideal choice for applications ranging from low-power computing and communication equipment to high-end industrial automation systems. It is also an excellent choice for gaming systems, as the thermal management system helps to ensure that the components remain cool while providing optimal performance.
This thermal-heat sink is also designed for easy installation and maintenance. It has an intuitive installation guide, making it simple for anyone to install it. It also comes with a comprehensive maintenance guide, making it easy to make repairs and carry out maintenance. This makes the ATS-11C-163-C1-R0 an ideal choice for any application requiring a reliable and efficient thermal management system.
The ATS-11C-163-C1-R0 is ideal for applications requiring good thermal management and reliable cooling performance. Its aluminum fin design ensures that maximum heat dissipation is achieved while minimizing the area needed for installation. Its easy installation and maintenance features also make it a popular choice for a range of different applications. Whatever the requirements, the ATS-11C-163-C1-R0 is an ideal choice for thermal- heat sinks.
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