ATS-11C-164-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-11C-164-C1-R0-ND

Manufacturer Part#:

ATS-11C-164-C1-R0

Price: $ 3.99
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X35MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11C-164-C1-R0 datasheetATS-11C-164-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.62061
30 +: $ 3.41922
50 +: $ 3.21817
100 +: $ 3.01701
250 +: $ 2.81588
500 +: $ 2.61474
1000 +: $ 2.56446
Stock 1000Can Ship Immediately
$ 3.99
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.378" (35.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 2.39°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinking is an important application field for engineers in many different industries. It is used to dissipate thermal energy, such as the heat generated by a motor or an electronics component. The ATS-11C-164-C1-R0 is a heat sink designed to transfer thermal energy directly to the atmosphere. It offers excellent performance and value for money, making it popular with industry professionals.

The ATS-11C-164-C1-R0 is a heat sink designed for use in industrial applications, where space is often at a premium. The heat sink is constructed of an anodized aluminum base and a copper fin array. The design is intended to maximize thermal transfer without compromising weight, form factor, or overall performance. The ATS-11C-164-C1-R0 is designed to fit a variety of popular electronic component packages, and is available in a variety of sizes, to meet the needs of any application.

The working principle of the ATS-11C-164-C1-R0 is relatively straightforward. Heat is generated by a component, and the heat sink absorbs a large part of this energy. The aluminum base and copper fin array act as a conductor, transferring the heat from the component to the fins. The fins then dissipate the heat away from the component to the atmosphere, ensuring that the temperatures of the component remain within the manufacturer\'s operating specifications.

The ATS-11C-164-C1-R0 is an extremely reliable and durable heat sink, and is rated for applications up to 1000W power dissipation. It has excellent thermal contact characteristics, meaning that it can effectively absorb and dissipate heat generated from high wattage components. The heat sink also offers excellent corrosion resistance, making it perfect for applications that require longer product life. Additionally, the ATS-11C-164-C1-R0 is compatible with a variety of fin types and mounting options, enabling engineers to customize the solution to their needs.

The ATS-11C-164-C1-R0 is an essential component for engineers in many different industries that require effective thermal management solutions. It offers excellent thermal performance, long term reliability, and value for money. With its versatile compatibility and design, the ATS-11C-164-C1-R0 is a great heat sink choice for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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