| Allicdata Part #: | ATS-11C-173-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-173-C1-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X30MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-173-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 1.181" (30.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.68°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-11C-173-C1-R0 heat sink is a new type of heat sink that is used in many applications. It is designed to provide efficient cooling to high-power electronic components. The ATS-11C-173-C1-R0 has an improved design that supports increased heat dissipation and air flow, which makes it an ideal choice for many types of applications.
The ATS-11C-173-C1-R0 consists of a base or "plate" which is made of a dielectric material, and fins or "pins" which are made from an aluminum alloy. The fins are attached to the base using an epoxy adhesive. The fins act as a heat dissipater, helping to spread the heat generated from the component(s) across the surface of the plate. The heat is then transferred away from the component by convection. The cooling performance is improved by increasing the surface area of the heat sink, which increases the amount of air that can be circulated around the fins.
The ATS-11C-173-C1-R0 is often used in applications where thermal management is crucial, such as servers, communications systems, and other high-performance electronics. The heat sink is designed to dissipate up to 25 Watts of heat per component at a rate of 80% efficiency. This makes it an excellent choice for dissipating heat from high-power components.
The ATS-11C-173-C1-R0 is easy to install and maintain, as it can be placed in a variety of orientations and secured with either bolts or adhesive. It can also be easily adjusted to optimize the cooling performance for the application. The design and construction of the ATS-11C-173-C1-R0 also ensures that it is highly resistant to corrosion and vibration, making it a durable heat sink for many types of applications.
In summary, the ATS-11C-173-C1-R0 heat sink is a well-designed thermal management solution that offers efficient cooling for high-power components in a variety of applications. Its design ensures that it is both easy to install and maintain, and highly resistant to corrosion and vibration. Its improved design allows for increased air flow and heat dissipation, making it an ideal choice for many types of applications.
The specific data is subject to PDF, and the above content is for reference