| Allicdata Part #: | ATS-11C-176-C1-R0-ND |
| Manufacturer Part#: |
ATS-11C-176-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X15MM R-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-176-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 8.56°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important aspect of any product or system. Heat sinks are often used to dissipate heat away from components to keep them from overheating. The ATS-11C-176-C1-R0 is a pin fin heat sink cooled by natural convection. This unit is designed for board-level applications and has a maximum power dissipation rating of 30 Watts.
The ATS-11C-176-C1-R0 is a two-piece aluminum construction with an effective six-layer air-cooled design that conforms to the IEC standard. It consists of a finned heat sink, which acts as a radiator, and a base plate, which helps to distribute the heat. The finned heat sink has alternating fin heights, which creates turbulent airflow and helps to maximize the heat transfer performance. The base plate is designed to provide a uniform and even heat distribution across the fins. The holes in the base plate are used to attach the heatsink to the board.
The ATS-11C-176-C1-R0 has a thermal resistance of 0.156 °C/W. This indicates that for every watt of heat that is generated, the temperature of the heatsink will increase by 0.156 °C. The natural convection of air around the heatsink helps to dissipate the heat away from the components. The efficiency of the design makes this product suitable for repeated high-power applications.
The ATS-11C-176-C1-R0 is designed to be used in a range of applications, including aviation, automotive, consumer electronics, communications, and industrial automation. It can be used on semiconductors, power supply boards, display screens, and other electronic components.
The ATS-11C-176-C1-R0 has a compact design that is suitable for high-density applications. The finned heat sink and enclosed base plate provide increased surface area for maximum performance. The simple construction does not require any additional mounting hardware. The included thermal pads help with the installation process.
The ATS-11C-176-C1-R0 is an efficient heat sink solution for board level applications with a maximum power dissipation rating of 30 Watts. The finned design coupled with the base plate provides improved heat dissipation, and the natural convection of air around the heatsink helps to keep components at a safe temperature. The compact design makes this product suitable for high-density applications, and the simple construction does not require any additional mounting hardware.
The specific data is subject to PDF, and the above content is for reference