ATS-11C-205-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-11C-205-C3-R0-ND

Manufacturer Part#:

ATS-11C-205-C3-R0

Price: $ 4.49
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 60X60X6MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-11C-205-C3-R0 datasheetATS-11C-205-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.03704
30 +: $ 3.81255
50 +: $ 3.58823
100 +: $ 3.36401
250 +: $ 3.13974
500 +: $ 2.91548
1000 +: $ 2.85942
Stock 1000Can Ship Immediately
$ 4.49
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.362" (60.00mm)
Width: 2.362" (60.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.236" (6.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 13.09°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks (sometimes referred to as heat sink components) are designed to dissipate heat from electronic components, assemblies, and systems. They are used to maintain proper heat balance within the system, regulate device temperature, and to protect against thermal damage. ATS-11C-205-C3-R0 is a good example of a thermal-heat sink.

ATS-11C-205-C3-R0 is a high performance thermal-heat sink designed to dissipate heat and protect sensitive electronic components. The heatsink has an aluminum profile frame with mounting feet for easy installation and an extruded fin design for effective contact and proper cooling. It has a rated thermal resistance of 0.95°C/W, and a rated air flow of 17 CFM.

The primary application of the ATS-11C-205-C3-R0 is in large and small form factor computers, as well as other devices where effective thermal dissipation is critical. The heatsink is also used in communications equipment and industrial automation applications. In addition, it can be used as a replacement for fans in high-temperature applications, such as high-density servers.

The working principle of the ATS-11C-205-C3-R0 is fairly simple. The aluminum profile frame forms a heat sink that provides a contact surface for air circulation and efficiently transfers the heat from the components to its fins. The heat is then dissipated by a combination of natural convection, radiation, and thermal-conductivity, as the air passes through the fins and is expelled by the fan. This creates a temperature gradient that attenuates the heat generated by the components. The fan can be used to maintain an airflow, or it can be set to a temperature cycle to maintain a stable operating temperature.

In summary, the ATS-11C-205-C3-R0 thermal heat sink is an efficient and effective component for dissipating heat in various applications. The aluminum profile frame is robust and reliable, and the efficient heat dissipation process via cooling fan enables the components to maintain an optimum temperature, ensuring their safe operation. The rated thermal resistance, air flow, and temperature cycles mean that the ATS-11C-205-C3-R0 can provide reliable performance in a wide range of heat dissipation applications.

The specific data is subject to PDF, and the above content is for reference

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