| Allicdata Part #: | ATS-11C-27-C3-R0-ND |
| Manufacturer Part#: |
ATS-11C-27-C3-R0 |
| Price: | $ 7.24 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12.7MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-27-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.51231 |
| 30 +: | $ 6.15027 |
| 50 +: | $ 5.78857 |
| 100 +: | $ 5.42676 |
| 250 +: | $ 5.06498 |
| 500 +: | $ 4.70319 |
| 1000 +: | $ 4.61275 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.28°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are essential for the efficient operation of modern electronic devices, from microprocessors to automotive forward facing radar systems. Heat sinks help to efficiently transfer the heat produced by electronic components to the ambient environment. ATS-11C-27-C3-R0 is a thermal management device designed to control the temperature of delicate electronic components, and is one of the most common and reliable thermal solutions in the market.
ATS-11C-27-C3-R0 heat sinks are designed for a variety of applications and are available in various configurations in order to meet different performance requirements. The device is designed specifically for use in harsh environmental conditions and is compatible with a range of operating temperatures. It is ideal for use in outdoor applications, thanks to its robust construction and strong resistance to environmental exposure.
The ATS-11C-27-C3-R0 is able to effectively manage the thermal load of electronic components by rapidly evacuating the heat produced. The highly efficient cooling capacity of the device is attributed to its advanced design and construction, which includes special-graded metallic alloy fins arranged in a very specific pattern. The spacing of the fins is specifically engineered to ensure a maximum cooling effect, while the low air resistance allows for the optimal flow of air over the fins.
The ATS-11C-27-C3-R0 is further equipped with specialized heat pipes that provide a low thermal resistance path for the transfer of heat from the source to the fins. These heat pipes incorporate a highly specialized wicking material which helps to draw the heat away from the source and bring it up to the fins. The fins, in turn, transfer the heat to the surrounding air with their high surface area, allowing for quick and efficient dissipation of heat.
The ATS-11C-27-C3-R0 is a very reliable and effective thermal management solution that can be used in a variety of applications, and is ideal for controlling the temperature of sensitive electronic components. Its robust construction and reliable operation makes it a popular choice for outdoor applications, and its highly efficient cooling capacity ensures that sensitive electronic components are kept within safe temperature limits.
The specific data is subject to PDF, and the above content is for reference