| Allicdata Part #: | ATS-11C-32-C3-R0-ND |
| Manufacturer Part#: |
ATS-11C-32-C3-R0 |
| Price: | $ 5.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 57.9X36.83X11.43MM T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-11C-32-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.08914 |
| 30 +: | $ 4.80669 |
| 50 +: | $ 4.52390 |
| 100 +: | $ 4.24116 |
| 250 +: | $ 3.95842 |
| 500 +: | $ 3.67567 |
| 1000 +: | $ 3.60499 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.280" (57.90mm) |
| Width: | 1.450" (36.83mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.450" (11.43mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 21.54°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks, or more commonly referred to as heat sinks, are a physical component that allows for efficient heat dissipation from various devices. ATS-11C-32-C3-R0 is a type of passive heat sink that has been designed to be highly effective in dissipating unwanted heat. The majority of these heat sinks are used in electronics, power supplies, and telecommunications applications.
ATS-11C-32-C3-R0 works by being able to draw the heat away from any device or component. It features a highly thermally conductive metal fins that exist on a base that is made of a material that allows for thermal conductivity. Once a device has been installed inside or on the heat sink, the fins direct and dissipate the heat into the environment by exchanging heat between the fin to the base. This allows for the denser air found near the cooling fins to remain in thermal equilibrium with cooler air that is found in the environment.
The main application field of the ATS-11C-32-C3-R0 is cooling components in electronics, such as LED lights, power supplies, electronic amplifiers, radio transceivers, and more. This heat sink has the advantage of being relatively lightweight, which makes it easier to use and deploy in compact and large scale designs. In the field of telecommunications, this heat sink can be used in a variety of applications, such as termination boxes, fibre optic transmitters, and digital switches.
It is also suitable for use in industrial applications, as it has the capability to dissipate heat in larger components such as air compressors, motors, turbines, and other temperature sensitive components. This type of heat sink also has the advantage of being able to handle larger heat loads while still providing efficient thermal spreading and cooling.
As previously mentioned, the ATS-11C-32-C3-R0 is a passive heat sink, which works by transferring heat away from its source. A key benefit of this type of heat sink is that it does not require any active cooling systems to function effectively. In addition, this heat sink is relatively easy to install and maintain, as it comes with all the required hardware and mounting brackets.
In summary, the ATS-11C-32-C3-R0 is a thermal - heat sink that is designed to be highly effective at dissipating unwanted heat. It is most commonly used in electronics, telecommunications, and industrial applications, and is lightweight and easy to install. The heat sink is also capable of handling larger heat loads while still providing efficient thermal spreading and cooling.
The specific data is subject to PDF, and the above content is for reference