ATS-11C-36-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.450" (11.43mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	14.82°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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ATS-11C-36-C2-R0 Thermal - Heat Sinks

Thermal - Heat Sinks are one of the most common components in electronics, providing a way to manage heat that is generated from the electronics. The ATS-11C-36-C2-R0 is an example of a Thermal - Heat Sink and is designed to provide efficient thermal dissipation of power electronics and circuit board components.The ATS-11C-36-C2-R0 is designed to dissipate heat from power electronics by using either convection or forced air cooling methods. In convection cooling, warmer air rises and is replaced by cooler air, thus providing a natural cooling system. Forced air cooling uses a fan within the ATS-11C-36-C2-R0 to circulate air across the surface of the heat sink, allowing greater dissipation of heat.The ATS-11C-36-C2-R0 is available in both U-type and V-type types. The U-type type features a U-Shaped design which maximizes space and light weight design while the V-type has a V-shaped design which offers improved thermal performance. The ATS-11C-36-C2-R0 is made of aluminum and is designed to be durable and able to withstand high temperatures.The ATS-11C-36-C2-R0 is also designed to be easy to install and fits standard I/O connectors on circuit boards. This Thermal - Heat Sink also uses a patented mounting system that is designed to securely hold it in place. The ATS-11C-36-C2-R0 has an integrated thermal pad which is designed to ensure optimal contact between the heat sink and the component it is cooling.The ATS-11C-36-C2-R0 is designed to provide a level of protection to I/O connectors, circuit components, and other sensitive materials. This Thermal - Heat Sink reduces heat generated from power devices, helping extend their useful life and reduce the risk of overheating and burnout. The ATS-11C-36-C2-R0 is also designed to remain cool to the touch and reduce noise from running components.The ATS-11C-36-C2-R0 is an ideal choice for the majority of electronics applications. This Thermal – Heat Sink’s design makes it an efficient choice for managing heat generation from I/Os, transistors, LEDs, ICs, and other electronics. By using the ATS-11C-36-C2-R0, designers can reduce risks of damaging their components through overheating, and allow for more efficient production processes. The ATS-11C-36-C2-R0 can also be used as a protection against environmental hazards. This Thermal - Heat Sink is designed to be resistant to dust, moisture, and salt, making it suitable for use in more severe environments. The ATS-11C-36-C2-R0 is also designed to be corrosion resistant and can withstand temperatures up to 200°C.Overall, the ATS-11C-36-C2-R0 is a reliable and efficient thermal solution. This Thermal - Heat Sink is designed to keep components cool, protecting them from damage and extending their life. It is also designed to be resistant to environmental hazards and corrosion, making it an ideal choice for a wide range of applications.

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